Agenda Planner - Programs

Sat, May 13, 2023 - 8:00 AM to 5:00 PM 5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp. Committee Chair: Symon Franklin, Custom Interconnect Ltd Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Sun, May 14, 2023 - 8:00 AM to 5:00 PM 5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp. Committee Chair: Symon Franklin, Custom Interconnect Ltd Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 2-19B: Trusted Supplier Task Group Committee Chair: Richard Snogren, Bristlecone LLC Event Type: Standards Development Meeting Location: 102E
Mon, May 15, 2023 - 8:00 AM to 12:00 PM 3-11A: Base Materials Committee Committee Chair: Albert Block, National Instruments Committee Chair: Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA) Event Type: Standards Development Meeting Location: 101A
Mon, May 15, 2023 - 8:00 AM to 12:00 PM 5-21H: Bottom Termination Components (BTC) Task Group Event Type: Standards Development Meeting Location: 102A
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 5-23B: Component and Wire Solderability Task Group Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Event Type: Standards Development Meeting Location: 101C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 5-33B: Solder Mask Task Group Committee Chair: Fonda Wu, Raytheon Company Event Type: Standards Development Meeting Location: 102C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group Committee Chair: Benoit Dagenais, Innovative Vehicle Institute Committee Chair: Jan Pedersen, NCAB Group AB Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 12:00 PM D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting Committee Chair: Scott Bowles, Lockheed Martin Corporation Committee Chair: Gerry Partida, Summit Interconnect - Anaheim Event Type: Standards Development Meeting Location: 103AB
Mon, May 15, 2023 - 10:00 AM to 12:00 PM 5-32G: Residue Assessment Task Group Committee Chair: Eric Camden, Foresite, Inc. Event Type: Standards Development Meeting Location: 102C
Mon, May 15, 2023 - 10:00 AM to 12:00 PM Faces of the Future Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 10:15 AM to 12:00 PM 1-13: Land Pattern Subcommittee Committee Chair: Michelle Gleason, Plexus Corp. Event Type: Standards Development Meeting Location: 102E
Mon, May 15, 2023 - 10:15 AM to 12:00 PM 2-17A: IPC-CFX Standard Task Group Committee Chair: Michael Ford, Aegis Software UK Committee Chair: Thomas Marktscheffel, ASMPT GmbH & Co. KG Event Type: Standards Development Meeting Location: 102B
Mon, May 15, 2023 - 10:15 AM to 12:00 PM 5-23A: Printed Circuit Board Solderability Specifications Task Group Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Event Type: Standards Development Meeting Location: 101C
Mon, May 15, 2023 - 10:15 AM to 12:00 PM 7-31FT: IPC/WHMA-A-620 Training Committee Committee Chair: Debbie Wade, Advanced Rework Technology Event Type: Standards Development Meeting Location: 103C
Mon, May 15, 2023 - 12:00 PM to 1:30 PM Monday Committee Luncheon Event Type: Standards Development Meeting Location: Ballroom C
Mon, May 15, 2023 - 1:30 PM to 5:00 PM 1-14: DFX Standards Subcommittee Committee Chair: Kevin Kusiak, Lockheed Martin Corporation Event Type: Standards Development Meeting Location: 102E
Mon, May 15, 2023 - 1:30 PM to 3:00 PM 2-19A: Critical Components Traceability Task Group Committee Chair: Radu Diaconescu, Swissmic Committee Chair: Michael Ford, Aegis Software UK Event Type: Standards Development Meeting Location: 102A
Mon, May 15, 2023 - 1:30 PM to 3:00 PM 3-12D: Woven Glass Reinforcement Task Group Committee Chair: Thomas Keily, JPS Composite Materials Corp. Event Type: Standards Development Meeting Location: 101A
Mon, May 15, 2023 - 1:30 PM to 3:00 PM 4-14F: ENEPIG Task Group Committee Chair: Jose Rios, Raytheon Event Type: Standards Development Meeting Location: 101C
Mon, May 15, 2023 - 1:30 PM to 3:00 PM 5-21G: Flip Chip Mounting Task Group Committee Chair: Ife Hsu, Intel Corporation Event Type: Standards Development Meeting Location: 103C
Mon, May 15, 2023 - 1:30 PM to 5:00 PM 5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp. Committee Chair: Symon Franklin, Custom Interconnect Ltd Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 1:30 PM to 3:00 PM 5-33A: Conformal Coating Task Group Committee Chair: Brian Chislea, Dow Corporation Event Type: Standards Development Meeting Location: 102C
Mon, May 15, 2023 - 1:30 PM to 3:00 PM D-33: Performance Standards Subcommittee Committee Chair: Steven Bowles, Lockheed Martin Corporation Event Type: Standards Development Meeting Location: 101B
Mon, May 15, 2023 - 3:15 PM to 5:00 PM 2-19C: Component-Level Authentication (CLA) Standard Task Group Committee Chair: Radu Diaconescu, Swissmic Committee Chair: Michael Ford, Aegis Software UK Event Type: Standards Development Meeting Location: 102A
Mon, May 15, 2023 - 3:15 PM to 5:00 PM 3-12E: Base Materials Roundtable Committee Chair: Terry Fischer, Showa Denko Materials (America), Inc. Event Type: Standards Development Meeting Location: 101A
Mon, May 15, 2023 - 3:15 PM to 5:00 PM 4-14B: ENIG Task Group Committee Chair: Ingrid Swenson, TTM Technologies, Inc. Event Type: Standards Development Meeting Location: 101C
Mon, May 15, 2023 - 3:15 PM to 5:00 PM 5-33F: Potting and Encapsulation Task Group Committee Chair: Brian Chislea, Dow Corporation Committee Chair: Torrey Clark, Dow Corporation Event Type: Standards Development Meeting Location: 102C
Mon, May 15, 2023 - 3:15 PM to 5:00 PM D-35: Printed Board Storage and Handling Subcommittee Committee Chair: Joseph Kane, BAE Systems Event Type: Standards Development Meeting Location: 101B
Mon, May 15, 2023 - 3:15 PM to 5:00 PM ESDS Control Plan Robert Cooke, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 101D
Tue, May 16, 2023 - 8:00 AM to 12:00 PM 2-16: Digital Product Model Exchange (DPMX) Subcommittee Committee Chair: Terry Hoffman, Cisco Systems Inc. Committee Chair: Chris Shaw, Fujitsu Network Communications Event Type: Standards Development Meeting Location: 101B
Tue, May 16, 2023 - 8:00 AM to 10:00 AM 2-30: Terms and Definitions Committee Committee Chair: David Caputa, Lockheed Martin Corporation Committee Chair: Aaron Kennedy, Summit Interconnect - Anaheim Event Type: Standards Development Meeting Location: 102D
Tue, May 16, 2023 - 8:00 AM to 10:00 AM 5-22AS: Space and Military Electronic Assemblies Task Group Committee Chair: Garry McGuire, NASA Marshall Space Flight Center Event Type: Standards Development Meeting Location: Ballroom AB
Tue, May 16, 2023 - 8:00 AM to 10:00 AM 5-24B: Solder Paste Task Group Committee Chair: Beverley Christian, HDP User Group Event Type: Standards Development Meeting Location: 102A
Tue, May 16, 2023 - 8:00 AM to 10:00 AM 5-24G: Polymerics Standard Task Group Committee Chair: Robert Cooke, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 102C
Tue, May 16, 2023 - 8:00 AM to 12:00 PM 5-33C: Conformal Coating Handbook Task Group Committee Chair: Jason Keeping, Celestica International L.P. Committee Chair: Fonda Wu, Raytheon Company Event Type: Standards Development Meeting Location: 102B
Tue, May 16, 2023 - 8:00 AM to 5:00 PM 7-31J: IPC-A-630 Task Group Committee Chair: Eddie Hofer, Collins Aerospace Committee Chair: Richard Rumas, Honeywell Canada Event Type: Standards Development Meeting Location: 103C
Tue, May 16, 2023 - 8:00 AM to 10:00 AM D-15: Flex Test Methods Methods Subcommittee Event Type: Standards Development Meeting Location: 102E
Tue, May 16, 2023 - 8:00 AM to 10:00 AM D-33-AP: Ultra HDI Subcommittee Committee Chair: Jan Pedersen, NCAB Group AB Committee Chair: Herb Snogren, Bristlecone LLC Event Type: Standards Development Meeting Location: 103AB
Tue, May 16, 2023 - 8:00 AM to 5:00 PM E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting Committee Chair: Chuck LePard, DXC Technology Event Type: Standards Development Meeting Location: 101C
Tue, May 16, 2023 - 10:00 AM to 12:00 PM 3-11J: Metal Based Laminates for Printed Boards Committee Chair: Minsu Lee, Korea Packaging Integration Association Event Type: Standards Development Meeting Location: 102D
Tue, May 16, 2023 - 10:00 AM to 12:00 PM 5-24A: Flux Specification Task Group Committee Chair: Anthony Lentz, FCT Assembly, Inc. Event Type: Standards Development Meeting Location: 102A
Tue, May 16, 2023 - 10:00 AM to 12:00 PM 7-31F-BLUEHEDGE: Blue Hedgehog Event Type: Standards Development Meeting Location: Ballroom AB
Tue, May 16, 2023 - 10:00 AM to 12:00 PM 7-31M: Fiber Optic Cable Acceptability Task Group Committee Chair: Robert Cooke, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 102C
Tue, May 16, 2023 - 10:00 AM to 12:00 PM D-12: Flexible Printed Circuits Performance Subcommittee Committee Chair: Nick Koop, TTM Technologies Event Type: Standards Development Meeting Location: 102E
Tue, May 16, 2023 - 10:00 AM to 12:00 PM iNemi Event Type: Standards Development Meeting
Tue, May 16, 2023 - 10:15 AM to 12:00 PM 2-12B: Model Based Definition (MBD) for Digital Twins Task Group Event Type: Standards Development Meeting Location: 101A
Tue, May 16, 2023 - 10:15 AM to 12:00 PM 7-31AT/D-33AT: IPC-A-600 and IPC-6012 Joint Meeting Committee Chair: Jamie Noland, Blackfox Training Institute Event Type: Standards Development Meeting Location: 103AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 2-12C: Cybersecurity Protection Standard Task Group Committee Chair: Hiroyuki Watanabe, NEC Platforms Ltd. Event Type: Standards Development Meeting Location: 101A
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 2-16D: IPC-2581 Users Task Group Committee Chair: Kevin Kusiak, Lockheed Martin Corporation Event Type: Standards Development Meeting Location: 101B
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 5-21M: Cold Joining/Press-fit Task Group Committee Chair: Erika Crandall, TE Connectivity, NC Committee Chair: Udo Welzel, Robert Bosch GmbH Event Type: Standards Development Meeting Location: 101D
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 5-24F: Underfill Materials Task Group Committee Chair: Brian Toleno, Facebook Event Type: Standards Development Meeting Location: 102A
Tue, May 16, 2023 - 1:30 PM to 5:00 PM 7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group Committee Chair: Garry McGuire, NASA Marshall Space Flight Center Event Type: Standards Development Meeting Location: Ballroom AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 7-31K/7-31H: IPC-D-620 and IPC-HDBK-620 Joint Meeting Committee Chair: Robert Cooke, NASA Johnson Space Center Event Type: Standards Development Meeting Location: 102C
Tue, May 16, 2023 - 1:30 PM to 3:00 PM 7-34T: IPC-7711 7721 Training Committee Committee Chair: Frank Honyotski, STI Electronics, Inc. Event Type: Standards Development Meeting Location: 103AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM B-10A: Plastic Chip Carrier Cracking Task Group Committee Chair: Christina Landon, Naval Surface Warfare Ctr Committee Chair: Steve Martell, Nordson ASYMTEK Event Type: Standards Development Meeting Location: 102B
Tue, May 16, 2023 - 1:30 PM to 3:00 PM D-11: Flexible Printed Board Design Subcommittee Committee Chair: Mark Finstad, Flexible Circuit Technologies, Inc. Event Type: Standards Development Meeting Location: 102E
Tue, May 16, 2023 - 1:30 PM to 3:00 PM D-23: High Speed High Frequency Base Materials Subcommittee Committee Chair: Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA) Event Type: Standards Development Meeting Location: 102D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM 2-12A: Generic Requirements for Digital Twin Task Group Instructor/Speaker: Radu Diaconescu, Swissmic Instructor/Speaker: Michael Ford, Aegis Software UK Event Type: Standards Development Meeting Location: 101A
Tue, May 16, 2023 - 3:15 PM to 5:00 PM 4-14E: OSP Task Group Committee Chair: Michael Carano, IPC Event Type: Standards Development Meeting Location: 102D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM 5-21N: Cold Joining/Press-fit Task Group Committee Chair: Erika Crandall, TE Connectivity, NC Committee Chair: Udo Welzel, Robert Bosch GmbH Event Type: Standards Development Meeting Location: 101D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM 6-10D: SMT Attachment Reliability Task Group Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Event Type: Standards Development Meeting Location: 102B
Tue, May 16, 2023 - 3:15 PM to 5:00 PM 7-31N: Manual Magnification Aides Task Group Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Event Type: Standards Development Meeting Location: 103AB
Tue, May 16, 2023 - 3:15 PM to 5:00 PM D-13: Flex Circuits Base Materials Committee Chair: Richard Wessel, DuPont Electronics & Imaging Event Type: Standards Development Meeting Location: 102E
Tue, May 16, 2023 - 3:15 PM to 5:00 PM D-22: RF/Microwave Printed Board Performance Subcommittee Committee Chair: Lance Auer, Conductor Analysis Technologies, Inc. Event Type: Standards Development Meeting Location: 101B
Tue, May 16, 2023 - 5:30 PM to 9:00 PM Tuesday Gnome Awards Event Type: Standards Development Meeting Location: Ballroom C
Wed, May 17, 2023 - 9:00 AM to 12:00 PM 7-12: Microsection Subcommittee Event Type: Standards Development Meeting Location: 103C
Wed, May 17, 2023 - 9:00 AM to 5:00 PM 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group Committee Chair: Gaston Hidalgo, Toyota Motor North America Committee Chair: Jose Servin Olivares, Vitesco Technologies Event Type: Standards Development Meeting Location: 102A
Wed, May 17, 2023 - 9:00 AM to 12:00 PM 7-35: Assembly and Joining Handbook Subcommittee Committee Chair: Joseph Kane, BAE Systems Event Type: Standards Development Meeting Location: Ballroom AB
Wed, May 17, 2023 - 9:00 AM to 12:00 PM D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting Committee Chair: Scott Bowles, Lockheed Martin Corporation Committee Chair: Gerry Partida, Summit Interconnect - Anaheim Event Type: Standards Development Meeting Location: 102C
Wed, May 17, 2023 - 9:00 AM to 5:00 PM E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting Committee Chair: Chuck LePard, DXC Technology Event Type: Standards Development Meeting Location: 102E
Wed, May 17, 2023 - 10:00 AM to 12:00 PM 3-12A: Metallic Foil Task Group Committee Chair: Erik Bergum, Founder PCB USA Event Type: Standards Development Meeting Location: 101C
Wed, May 17, 2023 - 10:00 AM to 12:00 PM 5-22BT: J-STD-001 Training Committee Committee Chair: George Tristan, Ball Aerospace & Technologies Corp. Event Type: Standards Development Meeting Location: 102D
Wed, May 17, 2023 - 10:00 AM to 12:00 PM Technology Solutions Committee Event Type: Standards Development Meeting Location: 101A
Wed, May 17, 2023 - 1:30 PM to 3:00 PM 3-13: Halogen-Free Materials Subcommittee Committee Chair: Naji Norder, National Instruments Event Type: Standards Development Meeting Location: 101C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM 5-22F: IPC-HDBK-001 Task Group Committee Chair: John Mastorides, Honeywell Aerospace Committee Chair: Scott Meyer, Collins Aerospace Event Type: Standards Development Meeting Location: Ballroom AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM 5-32E: Conductive Anodic Filament (CAF) Task Group Committee Chair: Karl Sauter, Oracle America, Inc. Event Type: Standards Development Meeting Location: 103AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM 7-24B: Printed Board Assembly Process Handbook Task Group Committee Chair: Zhiman Chen, ZhuZhou CRRC Times Electric Co., Ltd. Event Type: Standards Development Meeting Location: 101A
Wed, May 17, 2023 - 1:30 PM to 3:00 PM 7-31BT: IPC-A-610 Training Committee Committee Chair: Marie Parliman, BAE Systems Committee Chair: Helena Pasquito, EPTAC LLC Event Type: Standards Development Meeting Location: 103C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM 7-34: Repairability Subcommittee Committee Chair: Frank Honyotski, STI Electronics, Inc. Event Type: Standards Development Meeting Location: 102B
Wed, May 17, 2023 - 1:30 PM to 5:00 PM D-31B: IPC-2221/2222 Task Group Committee Chair: Michael Creeden, Insulectro Event Type: Standards Development Meeting Location: 102C
Wed, May 17, 2023 - 1:30 PM to 3:00 PM D-55: Embedded Devices Process Implementation Subcommittee Committee Chair: Raj Kumar, Northrop Grumman Space Systems Event Type: Standards Development Meeting Location: 102D
Wed, May 17, 2023 - 3:15 PM to 5:00 PM 5-24C: Solder Alloy Task Group Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: 101C
Wed, May 17, 2023 - 3:15 PM to 5:00 PM 5-31J: Cleaning Compatibility Committee Chair: William Capen, Honeywell FM&T Event Type: Standards Development Meeting Location: 102D
Wed, May 17, 2023 - 3:15 PM to 5:00 PM MIT Meet and Greet (By Invitation Only) Event Type: Standards Development Meeting Location: 103C
Thu, May 18, 2023 - 8:00 AM to 10:00 AM 3-11G: Metal Corrosion Task Group Committee Chair: Beverley Christian, HDP User Group Committee Chair: Christina Landon, Naval Surface Warfare Ctr Event Type: Standards Development Meeting Location: 102A
Thu, May 18, 2023 - 8:00 AM to 12:00 PM 7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group Committee Chair: Gaston Hidalgo, Toyota Motor North America Committee Chair: Jose Servin Olivares, Vitesco Technologies Event Type: Standards Development Meeting Location: 102D
Thu, May 18, 2023 - 8:00 AM to 5:00 PM 7-31F: IPC/WHMA-A-620 Task Group Committee Chair: Richard Rumas, Honeywell Canada Event Type: Standards Development Meeting Location: 102C
Thu, May 18, 2023 - 8:00 AM to 5:00 PM E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting Committee Chair: Chuck LePard, DXC Technology Event Type: Standards Development Meeting Location: 102E