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Date
Sat, May 13th, 2023
Sun, May 14th, 2023
Mon, May 15th, 2023
Tue, May 16th, 2023
Wed, May 17th, 2023
Thu, May 18th, 2023
Speaker
Aaron Kennedy, Summit Interconnect - Anaheim
Albert Block, National Instruments
Anthony Lentz, FCT Assembly, Inc.
Arik Vrobel, Cableteque
Benoit Dagenais, Innovative Vehicle Institute
Beverley Christian, HDP User Group
Brad Comstock, International Wire Group-Continental Cordage
Brian Chislea, Dow Corporation
Brian Toleno, Facebook
Carlos Plaza, IPC
Chris Frady, Hangar 5 Technologies
Chris Shaw, Fujitsu Network Communications
Christina Landon, Naval Surface Warfare Ctr
Christopher Strangio, CAMI Research Inc
Chuck LePard, DXC Technology
Darin Yeager, Cirris
Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
David Caputa, Lockheed Martin Corporation
David Selliman, Cableteque
Debbie Wade, Advanced Rework Technology
Dr. Kenneth F. Harris II Eng.D., The Aerospace Corporation
Eddie Hofer, Collins Aerospace
Eric Camden, Foresite, Inc.
Erik Bergum, Founder PCB USA
Erika Crandall, TE Connectivity, NC
Ernst Eggelaar, Microtronic M. V. GmbH
Fonda Wu, Raytheon Company
Frank Honyotski, STI Electronics, Inc.
Garry McGuire, NASA Marshall Space Flight Center
Gaston Hidalgo, Toyota Motor North America
George Tilli, Komax Corporation
George Tristan, Ball Aerospace & Technologies Corp.
Gerard Garcia, Hangar 5 Technologies
Gerard O'Brian, Solderability Testing & Solutions, Inc.
Gerry Partida, Summit Interconnect - Anaheim
Helena Pasquito, EPTAC LLC
Herb Snogren, Bristlecone LLC
Hiroyuki Watanabe, NEC Platforms Ltd.
Home Mojal, Telsonic Solutions
Ife Hsu, Intel Corporation
Ingrid Swenson, TTM Technologies, Inc.
Jamie Noland, Blackfox Training Institute
Jan Pedersen, NCAB Group AB
Jason Keeping, Celestica International L.P.
Jeff Barth, JWB Manufacturing, LLC
John Mastorides, Honeywell Aerospace
Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Jordan Jolly, Cetec ERP
Jose Rios, Raytheon
Jose Servin Olivares, Vitesco Technologies
Joseph Kane, BAE Systems
Karl Sauter, Oracle America, Inc.
Kevin Kusiak, Lockheed Martin Corporation
Kevin Shelley, Cirris, Inc.
Lance Auer, Conductor Analysis Technologies, Inc.
Les Bryson, Probity Tax Recovery
Lorena Villanueva
Marie Parliman, BAE Systems
Mark Finstad, Flexible Circuit Technologies, Inc.
Michael Carano, IPC
Michael Creeden, Insulectro
Michael Ford, Aegis Software UK
Michael Pierce, LPMS USA
Michelle Gleason, Plexus Corp.
Milea Kammer, Honeywell International
Minsu Lee, Korea Packaging Integration Association
Naji Norder, National Instruments
Nick Koop, TTM Technologies
Nicolas Brown, Synopsys, Inc.
Paul Harvell, E3.series, ZUKEN
Paul Johnston, Siemens Digital Industries Software
Paul Waszkowski, Eurotech Distributors
Radu Diaconescu, Swissmic
Raj Kumar, Northrop Grumman Space Systems
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Richard Wessel, DuPont Electronics & Imaging
Rob Boyd, Schleuniger, Inc
Robert Cooke, NASA Johnson Space Center
Robert Erickson, IPC
Sanu Warrier, nVent
Scott Bowles, Lockheed Martin Corporation
Scott Meyer, Collins Aerospace
Scott Ruland, DIT-MCO
Shamil Bicha, Avalon Technologies Ltd and Vice-Chairman, Indo-American Chamber of Commerce
Steve Martell, Nordson ASYMTEK
Steven Bowles, Lockheed Martin Corporation
Sudeep Davis Raavi, Sicame Group
Symon Franklin, Custom Interconnect Ltd
Terry Curtis, WireProcess Specialties
Terry Fischer, Showa Denko Materials (America), Inc.
Terry Hoffman, Cisco Systems Inc.
Terry Ng, LPMS USA
Thomas Keily, JPS Composite Materials Corp.
Thomas Marktscheffel, ASMPT GmbH & Co. KG
Tiberiu Baranyi, Flextronics Romania SRL
Todd Waddle, M. Holland
Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA)
Torrey Clark, Dow Corporation
Udo Welzel, Robert Bosch GmbH
William Capen, Honeywell FM&T
Yulia Leskovets, International Wire Group
Zhiman Chen, ZhuZhou CRRC Times Electric Co., Ltd.
Location
101A
101B
101C
101D
102A
102B
102C
102D
102E
103AB
103C
201-AB
202-AB
202-CDE
203-CD
Ballroom AB
Ballroom C
Exhibit Hall Entrance
Exhibit Hall Networking Lounge
Event Type
EWPTE Special Event
Professional Development
Standards Development Meeting
Technical Conference Session
Programs: 121 - 125 of 125
Programs per Page
5
10
20
30
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100
500
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All
Thu, May 18, 2023 - 11:00 AM to 12:00 PM
Cable and Wire Harness Industry: Ecosystem & Opportunities in Tamil Nadu, India
Instructor/Speaker: Shamil Bicha, Avalon Technologies Ltd and Vice-Chairman, Indo-American Chamber of Commerce (Tamil Nadu)
Event Type: Technical Conference Session
Location: 202-AB
Thu, May 18, 2023 - 11:00 AM to 12:00 PM
How Wire Braids are Manufactured
Instructor/Speaker: Yulia Leskovets, International Wire Group
Instructor/Speaker: Brad Comstock, International Wire Group-Continental Cordage
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 12:30 PM to 1:00 PM
The Significance of Quality
Instructor/Speaker: Gerard Garcia, Hangar 5 Technologies
Instructor/Speaker: Chris Frady, Hangar 5 Technologies
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 12:30 PM to 1:00 PM
Flexible Copper Cable Electrical Performance Linked to Crimping Compaction
Instructor/Speaker: Sudeep Davis Raavi, OEM Engineering Program Manager, Sicame Group
Event Type: Technical Conference Session
Location: 202-AB
Thu, May 18, 2023 - 2:00 PM to 3:00 PM
Thursday Afternoon Networking Refreshment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
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