Sat, May 13, 2023 - 8:00 AM to 5:00 PM
5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Committee Chair: Symon Franklin, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL
Committee Chair: Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: Ballroom AB
Sun, May 14, 2023 - 8:00 AM to 5:00 PM
5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Committee Chair: Symon Franklin, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL
Committee Chair: Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 10:00 AM
2-19B: Trusted Supplier Task Group
Committee Chair: Richard Snogren, Bristlecone LLC
Event Type: Standards Development Meeting
Location: 102E
Mon, May 15, 2023 - 8:00 AM to 12:00 PM
3-11A: Base Materials Committee
Committee Chair: Albert Block, National Instruments
Committee Chair: Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
Event Type: Standards Development Meeting
Location: 101A
Mon, May 15, 2023 - 8:00 AM to 12:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
Event Type: Standards Development Meeting
Location: 102A
Mon, May 15, 2023 - 8:00 AM to 10:00 AM
5-23B: Component and Wire Solderability Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 101C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM
5-33B: Solder Mask Task Group
Committee Chair: Fonda Wu, Raytheon Company
Event Type: Standards Development Meeting
Location: 102C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Committee Chair: Benoit Dagenais, Innovative Vehicle Institute
Committee Chair: Jan Pedersen, NCAB Group AB
Event Type: Standards Development Meeting
Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 12:00 PM
D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
Committee Chair: Scott Bowles, Lockheed Martin Corporation
Committee Chair: Gerry Partida, Summit Interconnect - Anaheim
Event Type: Standards Development Meeting
Location: 103AB
Mon, May 15, 2023 - 10:00 AM to 12:00 PM
5-32G: Residue Assessment Task Group
Committee Chair: Eric Camden, Foresite, Inc.
Event Type: Standards Development Meeting
Location: 102C
Mon, May 15, 2023 - 10:00 AM to 12:00 PM
Faces of the Future
Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: Ballroom AB
Mon, May 15, 2023 - 10:15 AM to 12:00 PM
1-13: Land Pattern Subcommittee
Committee Chair: Michelle Gleason, Plexus Corp.
Event Type: Standards Development Meeting
Location: 102E
Mon, May 15, 2023 - 10:15 AM to 12:00 PM
2-17A: IPC-CFX Standard Task Group
Committee Chair: Michael Ford, Aegis Software UK
Committee Chair: Thomas Marktscheffel, ASMPT GmbH & Co. KG
Event Type: Standards Development Meeting
Location: 102B
Mon, May 15, 2023 - 10:15 AM to 12:00 PM
5-23A: Printed Circuit Board Solderability Specifications Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 101C
Mon, May 15, 2023 - 10:15 AM to 12:00 PM
7-31FT: IPC/WHMA-A-620 Training Committee
Committee Chair: Debbie Wade, Advanced Rework Technology
Event Type: Standards Development Meeting
Location: 103C
Mon, May 15, 2023 - 12:00 PM to 1:30 PM
Monday Committee Luncheon
Event Type: Standards Development Meeting
Location: Ballroom C
Mon, May 15, 2023 - 1:30 PM to 5:00 PM
1-14: DFX Standards Subcommittee
Committee Chair: Kevin Kusiak, Lockheed Martin Corporation
Event Type: Standards Development Meeting
Location: 102E
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
2-19A: Critical Components Traceability Task Group
Committee Chair: Radu Diaconescu, Swissmic
Committee Chair: Michael Ford, Aegis Software UK
Event Type: Standards Development Meeting
Location: 102A
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Committee Chair: Thomas Keily, JPS Composite Materials Corp.
Event Type: Standards Development Meeting
Location: 101A
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
4-14F: ENEPIG Task Group
Committee Chair: Jose Rios, Raytheon
Event Type: Standards Development Meeting
Location: 101C
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
5-21G: Flip Chip Mounting Task Group
Committee Chair: Ife Hsu, Intel Corporation
Event Type: Standards Development Meeting
Location: 103C
Mon, May 15, 2023 - 1:30 PM to 5:00 PM
5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Committee Chair: Symon Franklin, Custom Interconnect Ltd
Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL
Committee Chair: Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: Ballroom AB
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
5-33A: Conformal Coating Task Group
Committee Chair: Brian Chislea, Dow Corporation
Event Type: Standards Development Meeting
Location: 102C
Mon, May 15, 2023 - 1:30 PM to 3:00 PM
D-33: Performance Standards Subcommittee
Committee Chair: Steven Bowles, Lockheed Martin Corporation
Event Type: Standards Development Meeting
Location: 101B
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
2-19C: Component-Level Authentication (CLA) Standard Task Group
Committee Chair: Radu Diaconescu, Swissmic
Committee Chair: Michael Ford, Aegis Software UK
Event Type: Standards Development Meeting
Location: 102A
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable
Committee Chair: Terry Fischer, Showa Denko Materials (America), Inc.
Event Type: Standards Development Meeting
Location: 101A
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
4-14B: ENIG Task Group
Committee Chair: Ingrid Swenson, TTM Technologies, Inc.
Event Type: Standards Development Meeting
Location: 101C
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
5-33F: Potting and Encapsulation Task Group
Committee Chair: Brian Chislea, Dow Corporation
Committee Chair: Torrey Clark, Dow Corporation
Event Type: Standards Development Meeting
Location: 102C
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Committee Chair: Joseph Kane, BAE Systems
Event Type: Standards Development Meeting
Location: 101B
Mon, May 15, 2023 - 3:15 PM to 5:00 PM
ESDS Control Plan
Robert Cooke, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 101D
Tue, May 16, 2023 - 8:00 AM to 12:00 PM
2-16: Digital Product Model Exchange (DPMX) Subcommittee
Committee Chair: Terry Hoffman, Cisco Systems Inc.
Committee Chair: Chris Shaw, Fujitsu Network Communications
Event Type: Standards Development Meeting
Location: 101B
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
2-30: Terms and Definitions Committee
Committee Chair: David Caputa, Lockheed Martin Corporation
Committee Chair: Aaron Kennedy, Summit Interconnect - Anaheim
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
5-22AS: Space and Military Electronic Assemblies Task Group
Committee Chair: Garry McGuire, NASA Marshall Space Flight Center
Event Type: Standards Development Meeting
Location: Ballroom AB
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
5-24B: Solder Paste Task Group
Committee Chair: Beverley Christian, HDP User Group
Event Type: Standards Development Meeting
Location: 102A
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
5-24G: Polymerics Standard Task Group
Committee Chair: Robert Cooke, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 102C
Tue, May 16, 2023 - 8:00 AM to 12:00 PM
5-33C: Conformal Coating Handbook Task Group
Committee Chair: Jason Keeping, Celestica International L.P.
Committee Chair: Fonda Wu, Raytheon Company
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Committee Chair: Eddie Hofer, Collins Aerospace
Committee Chair: Richard Rumas, Honeywell Canada
Event Type: Standards Development Meeting
Location: 103C
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
D-15: Flex Test Methods Methods Subcommittee
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 8:00 AM to 10:00 AM
D-33-AP: Ultra HDI Subcommittee
Committee Chair: Jan Pedersen, NCAB Group AB
Committee Chair: Herb Snogren, Bristlecone LLC
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 8:00 AM to 5:00 PM
E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting
Committee Chair: Chuck LePard, DXC Technology
Event Type: Standards Development Meeting
Location: 101C
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
10X Your Brand and Website Traffic Utilizing Social Media
Instructor/Speaker: Jeff Barth, President, JWB Manufacturing, LLC
Event Type: Professional Development
Location: 202-AB
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
3-11J: Metal Based Laminates for Printed Boards
Committee Chair: Minsu Lee, Korea Packaging Integration Association
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
5-24A: Flux Specification Task Group
Committee Chair: Anthony Lentz, FCT Assembly, Inc.
Event Type: Standards Development Meeting
Location: 102A
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
7-31F-BLUEHEDGE: Blue Hedgehog
Event Type: Standards Development Meeting
Location: Ballroom AB
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Committee Chair: Robert Cooke, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 102C
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
D-12: Flexible Printed Circuits Performance Subcommittee
Committee Chair: Nick Koop, TTM Technologies
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 10:00 AM to 11:30 AM
Improving Reliability of Continuity and HiPot Testing Part 1
Instructor/Speaker: Christopher Strangio, CAMI Research Inc
Event Type: Professional Development
Location: 201-AB
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
iNemi
Event Type: Standards Development Meeting
Tue, May 16, 2023 - 10:00 AM to 12:00 PM
What Are ISO Auditors Looking For? How To Meet Your Quality Requirements Quickly & Effectively
Instructor/Speaker: Jordan Jolly, Director, Cetec ERP
Event Type: Professional Development
Location: 202-CDE
Tue, May 16, 2023 - 10:15 AM to 12:00 PM
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
Event Type: Standards Development Meeting
Location: 101A
Tue, May 16, 2023 - 10:15 AM to 12:00 PM
7-31AT/D-33AT: IPC-A-600 and IPC-6012 Joint Meeting
Committee Chair: Jamie Noland, Blackfox Training Institute
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 1:00 PM to 3:00 PM
Electronics Encapsulation Techniques: Low Pressure Molding
Instructor/Speaker: Michael Pierce, Lead Polymer Chemist, LPMS USA
Terry Ng, Lead Material Scientist, LPMS USA
Event Type: Professional Development
Location: 202-CDE
Tue, May 16, 2023 - 1:00 PM to 4:00 PM
Improving Reliability of Continuity and HiPot Testing Part 2
Instructor/Speaker: Christopher Strangio, CAMI Research Inc
Event Type: Professional Development
Location: 201-AB
Tue, May 16, 2023 - 1:00 PM to 2:30 PM
IPC in Mexico, Strengthening the Supply Chain for the Electronics Industry
Instructor/Speaker: Lorena Villanueva, Director for IPC in Mexico
Instructor/Speaker: Robert Erickson, Director of Education Product Management, IPC
Event Type: Professional Development
Location: 202-AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
2-12C: Cybersecurity Protection Standard Task Group
Committee Chair: Hiroyuki Watanabe, NEC Platforms Ltd.
Event Type: Standards Development Meeting
Location: 101A
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
2-16D: IPC-2581 Users Task Group
Committee Chair: Kevin Kusiak, Lockheed Martin Corporation
Event Type: Standards Development Meeting
Location: 101B
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
5-21M: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall, TE Connectivity, NC
Committee Chair: Udo Welzel, Robert Bosch GmbH
Event Type: Standards Development Meeting
Location: 101D
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Task Group
Committee Chair: Brian Toleno, Facebook
Event Type: Standards Development Meeting
Location: 102A
Tue, May 16, 2023 - 1:30 PM to 5:00 PM
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
Committee Chair: Garry McGuire, NASA Marshall Space Flight Center
Event Type: Standards Development Meeting
Location: Ballroom AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
7-31K/7-31H: IPC-D-620 and IPC-HDBK-620 Joint Meeting
Committee Chair: Robert Cooke, NASA Johnson Space Center
Event Type: Standards Development Meeting
Location: 102C
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Committee Chair: Frank Honyotski, STI Electronics, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Committee Chair: Christina Landon, Naval Surface Warfare Ctr
Committee Chair: Steve Martell, Nordson ASYMTEK
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Committee Chair: Mark Finstad, Flexible Circuit Technologies, Inc.
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
Committee Chair: Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA)
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 3:00 PM to 5:00 PM
Ultrasonic Metal Welding Basics and Applications Trend
Instructor/Speaker: Home Mojal, Special Systems Sales Manager, Telsonic Solutions
Event Type: Professional Development
Location: 202-AB
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
Instructor/Speaker: Radu Diaconescu, Swissmic
Instructor/Speaker: Michael Ford, Aegis Software UK
Event Type: Standards Development Meeting
Location: 101A
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
4-14E: OSP Task Group
Committee Chair: Michael Carano, IPC
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall, TE Connectivity, NC
Committee Chair: Udo Welzel, Robert Bosch GmbH
Event Type: Standards Development Meeting
Location: 101D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Committee Chair: Richard Wessel, DuPont Electronics & Imaging
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
Committee Chair: Lance Auer, Conductor Analysis Technologies, Inc.
Event Type: Standards Development Meeting
Location: 101B
Tue, May 16, 2023 - 5:30 PM to 9:00 PM
Tuesday Gnome Awards
Event Type: Standards Development Meeting
Location: Ballroom C
Wed, May 17, 2023 - 8:00 AM to 9:00 AM
Opening Keynote - Building the Future
Instructor/Speaker: Dr. Kenneth F. Harris II Eng.D., Senior Project Engineer, Space Integration and Asset Protection, The Aerospace Corporation
Event Type: Technical Conference Session
Location: Ballroom C
Wed, May 17, 2023 - 8:45 AM to 9:00 AM
Ribbon Cutting Ceremony
Event Type: EWPTE Special Event
Location: Exhibit Hall Entrance
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
7-12: Microsection Subcommittee
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 9:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Committee Chair: Gaston Hidalgo, Toyota Motor North America
Committee Chair: Jose Servin Olivares, Vitesco Technologies
Event Type: Standards Development Meeting
Location: 102A
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Committee Chair: Joseph Kane, BAE Systems
Event Type: Standards Development Meeting
Location: Ballroom AB
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
Committee Chair: Scott Bowles, Lockheed Martin Corporation
Committee Chair: Gerry Partida, Summit Interconnect - Anaheim
Event Type: Standards Development Meeting
Location: 102C
Wed, May 17, 2023 - 9:00 AM to 5:00 PM
E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting
Committee Chair: Chuck LePard, DXC Technology
Event Type: Standards Development Meeting
Location: 102E
Wed, May 17, 2023 - 9:00 AM to 10:00 AM
Networking Morning Refreshment Break with Mimosa Bar
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Wed, May 17, 2023 - 9:00 AM to 10:00 AM
Wednesday Morning Networking Refreshment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Wed, May 17, 2023 - 9:30 AM to 10:30 AM
The Effective Automation of Things
Instructor/Speaker: Rob Boyd, Senior Product Manager, Schleuniger, Inc
Event Type: Technical Conference Session
Location: 202-CDE
Wed, May 17, 2023 - 9:30 AM to 10:30 AM
Upstream Testing for Error-Proof Assembly
Instructor/Speaker: Kevin Shelley, Product Manager, Cirris, Inc.
Event Type: Technical Conference Session
Location: 203-CD
Wed, May 17, 2023 - 9:30 AM to 10:30 AM
Wire Harness Workforce Training Overview
Instructor/Speaker: Carlos Plaza, IPC
Event Type: Technical Conference Session
Location: 202-AB
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, Founder PCB USA
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
5-22BT: J-STD-001 Training Committee
Committee Chair: George Tristan, Ball Aerospace & Technologies Corp.
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
Technology Solutions Committee
Event Type: Standards Development Meeting
Location: 101A
Wed, May 17, 2023 - 11:00 AM to 12:00 PM
Simplify Manufacturing Automation to Overcome Skilled Labor Shortages
Instructor/Speaker: Paul Harvell, Product Director, E3.series, ZUKEN
Sanu Warrier, Product Director, nVent
Event Type: Technical Conference Session
Location: 202-CDE
Wed, May 17, 2023 - 11:00 AM to 11:30 AM
Using Technology to Increase Throughput and Reduce Errors in Wire Harness Production
Instructor/Speaker: Scott Ruland, Director of Engineering, DIT-MCO
Event Type: Technical Conference Session
Location: 203-CD
Wed, May 17, 2023 - 11:00 AM to 12:00 PM
What Electric and Autonomous Vehicle Companies Teach Us About Lean and Efficient Wiring Harness Design and Manufacture
Instructor/Speaker: Paul Johnston, Portfolio Development Executive, Siemens Digital Industries Software
Event Type: Technical Conference Session
Location: 202-AB
Wed, May 17, 2023 - 1:00 PM to 2:00 PM
How Electrification and Sustainability are Linked
Instructor/Speaker: Todd Waddle, Director for the Wire & Cable and Sustainability market segments, M. Holland
Event Type: Technical Conference Session
Location: 202-AB
Wed, May 17, 2023 - 1:00 PM to 1:30 PM
Risks of Over-Specifying Test Requirements: Testing Shielded Cables at High Voltage
Instructor/Speaker: Christopher Strangio, CAMI Research Inc
Event Type: Technical Conference Session
Location: 203-CD
Wed, May 17, 2023 - 1:00 PM to 2:00 PM
Tax Implications for Manufactures - 2023 and Beyond 
Instructor/Speaker: Les Bryson, Co-Founder and Managing Partner, Probity Tax Recovery
Event Type: Technical Conference Session
Location: 202-CDE
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Materials Subcommittee
Committee Chair: Naji Norder, National Instruments
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Committee Chair: John Mastorides, Honeywell Aerospace
Committee Chair: Scott Meyer, Collins Aerospace
Event Type: Standards Development Meeting
Location: Ballroom AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Committee Chair: Karl Sauter, Oracle America, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Committee Chair: Zhiman Chen, ZhuZhou CRRC Times Electric Co., Ltd.
Event Type: Standards Development Meeting
Location: 101A
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
7-31BT: IPC-A-610 Training Committee
Committee Chair: Marie Parliman, BAE Systems
Committee Chair: Helena Pasquito, EPTAC LLC
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM
7-34: Repairability Subcommittee
Committee Chair: Frank Honyotski, STI Electronics, Inc.
Event Type: Standards Development Meeting
Location: 102B
Wed, May 17, 2023 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Michael Creeden, Insulectro
Event Type: Standards Development Meeting
Location: 102C
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Committee Chair: Raj Kumar, Northrop Grumman Space Systems
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 2:00 PM to 3:00 PM
Networking Afternoon Refrehment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Preparing the Terminal Crimp Process for Industry 4.0
Instructor/Speaker: Terry Curtis, President, WireProcess Specialties
Event Type: Technical Conference Session
Location: 203-CD
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Sealed Wires and Splices - How Are We doing?
Instructor/Speaker: Paul Waszkowski, Eurotech Distributors
Event Type: Technical Conference Session
Location: 202-AB
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Trends in Automation and Digital Solutions for Wire Harness and EDS Systems
Instructor/Speaker: George Tilli, Digital Product Manager, Komax Corporation
Event Type: Technical Conference Session
Location: 202-CDE
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
5-31J: Cleaning Compatibility
Committee Chair: William Capen, Honeywell FM&T
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
MIT Meet and Greet (By Invitation Only)
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 5:00 PM to 7:00 PM
After Hours VIP Party
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Thu, May 18, 2023 - 7:00 AM to 8:30 AM
Networking Breakfast with Exhibitors
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Thu, May 18, 2023 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Committee Chair: Beverley Christian, HDP User Group
Committee Chair: Christina Landon, Naval Surface Warfare Ctr
Event Type: Standards Development Meeting
Location: 102A
Thu, May 18, 2023 - 8:00 AM to 12:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Committee Chair: Gaston Hidalgo, Toyota Motor North America
Committee Chair: Jose Servin Olivares, Vitesco Technologies
Event Type: Standards Development Meeting
Location: 102D
Thu, May 18, 2023 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Committee Chair: Richard Rumas, Honeywell Canada
Event Type: Standards Development Meeting
Location: 102C
Thu, May 18, 2023 - 8:00 AM to 5:00 PM
E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting
Committee Chair: Chuck LePard, DXC Technology
Event Type: Standards Development Meeting
Location: 102E
Thu, May 18, 2023 - 9:00 AM to 10:00 AM
Networking Morning Refreshment Break with Bloody Mary Bar
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Thu, May 18, 2023 - 9:00 AM to 9:30 AM
Quickly and Reliably Design and Verify Vehicle Electrical Systems
Instructor/Speaker: Nicolas Brown, A&MS Circuit Design Engineer, Synopsys, Inc.
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 9:00 AM to 10:00 AM
Thursday Morning Networking Refreshment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Thu, May 18, 2023 - 9:30 AM to 10:30 AM
Automated Electrical Testing Equipment – Principles of High Voltage Tests
Instructor/Speaker: Darin Yeager, Cirris
Event Type: Technical Conference Session
Location: 202-AB
Thu, May 18, 2023 - 10:00 AM to 10:30 AM
Predictive Interconnect Analytics " Enabling Your Design Potential
Instructor/Speaker: Arik Vrobel, Founder, Cableteque
Instructor/Speaker: David Selliman, Cableteque
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 11:00 AM to 12:00 PM
Cable and Wire Harness Industry: Ecosystem & Opportunities in Tamil Nadu, India
Instructor/Speaker: Shamil Bicha, Avalon Technologies Ltd and Vice-Chairman, Indo-American Chamber of Commerce (Tamil Nadu)
Event Type: Technical Conference Session
Location: 202-AB
Thu, May 18, 2023 - 11:00 AM to 12:00 PM
How Wire Braids are Manufactured
Instructor/Speaker: Yulia Leskovets, International Wire Group
Instructor/Speaker: Brad Comstock, International Wire Group-Continental Cordage
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 12:30 PM to 1:00 PM

The Significance of Quality
Instructor/Speaker: Gerard Garcia, Hangar 5 Technologies
Instructor/Speaker: Chris Frady, Hangar 5 Technologies
Event Type: Technical Conference Session
Location: 202-CDE
Thu, May 18, 2023 - 12:30 PM to 1:00 PM
Flexible Copper Cable Electrical Performance Linked to Crimping Compaction
Instructor/Speaker: Sudeep Davis Raavi, OEM Engineering Program Manager, Sicame Group
Event Type: Technical Conference Session
Location: 202-AB
Thu, May 18, 2023 - 2:00 PM to 3:00 PM
Thursday Afternoon Networking Refreshment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge