Agenda Planner - Programs

Sat, May 13, 2023 - 8:00 AM to 5:00 PM 5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp. Committee Chair: Symon Franklin, Custom Interconnect Ltd Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Sun, May 14, 2023 - 8:00 AM to 5:00 PM 5-22A AND 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting Committee Chair: Jonathon Vermillion, Ball Aerospace & Technologies Corp. Committee Chair: Symon Franklin, Custom Interconnect Ltd Committee Chair: Tiberiu Baranyi, Flextronics Romania SRL Committee Chair: Milea Kammer, Honeywell International Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 2-19B: Trusted Supplier Task Group Committee Chair: Richard Snogren, Bristlecone LLC Event Type: Standards Development Meeting Location: 102E
Mon, May 15, 2023 - 8:00 AM to 12:00 PM 3-11A: Base Materials Committee Committee Chair: Albert Block, National Instruments Committee Chair: Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA) Event Type: Standards Development Meeting Location: 101A
Mon, May 15, 2023 - 8:00 AM to 12:00 PM 5-21H: Bottom Termination Components (BTC) Task Group Event Type: Standards Development Meeting Location: 102A
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 5-23B: Component and Wire Solderability Task Group Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc. Event Type: Standards Development Meeting Location: 101C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 5-33B: Solder Mask Task Group Committee Chair: Fonda Wu, Raytheon Company Event Type: Standards Development Meeting Location: 102C
Mon, May 15, 2023 - 8:00 AM to 10:00 AM 7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group Committee Chair: Benoit Dagenais, Innovative Vehicle Institute Committee Chair: Jan Pedersen, NCAB Group AB Event Type: Standards Development Meeting Location: Ballroom AB
Mon, May 15, 2023 - 8:00 AM to 12:00 PM D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting Committee Chair: Scott Bowles, Lockheed Martin Corporation Committee Chair: Gerry Partida, Summit Interconnect - Anaheim Event Type: Standards Development Meeting Location: 103AB
Mon, May 15, 2023 - 10:00 AM to 12:00 PM 5-32G: Residue Assessment Task Group Committee Chair: Eric Camden, Foresite, Inc. Event Type: Standards Development Meeting Location: 102C