Wed, May 17, 2023 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Committee Chair: Michael Creeden, Insulectro
Event Type: Standards Development Meeting
Location: 102C
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Committee Chair: Raj Kumar, Northrop Grumman Space Systems
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 2:00 PM to 3:00 PM
Networking Afternoon Refrehment Break
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Preparing the Terminal Crimp Process for Industry 4.0
Instructor/Speaker: Terry Curtis, President, WireProcess Specialties
Event Type: Technical Conference Session
Location: 203-CD
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Sealed Wires and Splices - How Are We doing?
Instructor/Speaker: Paul Waszkowski, Eurotech Distributors
Event Type: Technical Conference Session
Location: 202-AB
Wed, May 17, 2023 - 3:00 PM to 4:00 PM
Trends in Automation and Digital Solutions for Wire Harness and EDS Systems
Instructor/Speaker: George Tilli, Digital Product Manager, Komax Corporation
Event Type: Technical Conference Session
Location: 202-CDE
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
5-24C: Solder Alloy Task Group
Committee Chair: Milea Kammer, Honeywell International
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
5-31J: Cleaning Compatibility
Committee Chair: William Capen, Honeywell FM&T
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 3:15 PM to 5:00 PM
MIT Meet and Greet (By Invitation Only)
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 5:00 PM to 7:00 PM
After Hours VIP Party
Event Type: EWPTE Special Event
Location: Exhibit Hall Networking Lounge