Tintronics offers true component level value add services - meet or exceed the industry specifications required by our ever-changing electronics marketplace - Services Include; XRF analysis, State of the Art Robotic Mitigation/Hot Solder Dip, gold removal, solderability enhancement, BGA repair/reball, Surface mount tape and reel, thru-hole tape and reel, form & excise for Surface mount components, forming of thru-hole devices, Dry packaging, Solderability Testing, Cleanliness testing - J-STD, Mil-STD, GEIA, EIA, AS9100 REV D, ISO9001:2008 SDVOSB (less)