Toggle navigation
Home
New Products
Product Showcase
New Products
Videos
Exhibitors
Floor Plan
Programs
Programs
Instructor/Speaker(s)
Register
Log In
Browse All Programs
Print List of Programs
IPC APEX EXPO 2022
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
Instructor/Speaker: John Lau, Unimicron Technology Corporation
Seminar Type: Professional Development
Track: F2
Location: 4
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP) Part B