IPC APEX EXPO 2022
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 5AB
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1