Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-21: RF/Microwave Printed Board Design Subcommittee
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: High Speed/High Frequency Interconnections
Location: 9
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 8
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-60: Printed Electronics Committee
Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Alpha Electronics Solutions
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Standards Development Meeting: Printed Electronics
Location: 11A
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-75A: E-Textiles Wearables Standard Task Group
Chair: Vladan Koncar, Professor, ENSAIT GEMTEX Lab
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 16B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
MIT Meet and greet
Seminar Type: Special Event
Location: 15AB
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
V-DCL: Design Community Leadership
Seminar Type: Standards Development Meeting
Location: 7B
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S21: AFFOA Session: Advancements in E-Textiles 1
Moderator: Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 2
S21: AFFOA Session: Advancements in E-Textiles 1
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S22 BF6 Printed Circuit Structures
Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S22 BF6 Printed Circuit Structures
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S23 QRTI 6 Electrical Test Methods 2
 
Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S23 QRTI 6 Electrical Test Methods 2