Agenda Planner - Programs

Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM 1:10C: Test Coupon and Artwork Generation Task Group Chair: Philip Henault, Development Engineer, Raytheon Seminar Type: Standards Development Meeting Track: Design General Standards Development Meeting: Printed Board Design Technology Location: 15AB
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM 3-12E: Base Materials Roundtable Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc. Seminar Type: Standards Development Meeting Track: PCB Fabrications and Materials General Standards Development Meeting: Base Materials Location: 7A
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM B-10a/JEDEC Seminar Type: Standards Development Meeting Location: 7B
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM D-35: Printed Board Storage and Handling Subcommittee Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems Seminar Type: Standards Development Meeting Track: PCB Fabrications and Materials General Standards Development Meeting: Rigid Printed Boards Location: 10
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM CANCELLED ~~PD29: Measurement System Analysis For Electronics Assemblies - Part II~~ Instructor/Speaker: José Servin, Ph.D., Material Expert, Continental Temic SA de CV Seminar Type: Professional Development Track: Test Location: 1AB
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM PD26: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Board Talk - Part II Instructor/Speaker: Phil Zarrow, President, ITM Consulting Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting Seminar Type: Professional Development Track: Assembly Location: 5AB PD26: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Bo
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM PD27: Reliability of Electronics - Role of Intermetallic Compounds Instructor/Speaker: Jennie S. Hwang, Ph.D., CEO, H-Technologies Group Seminar Type: Professional Development Track: Assembly Location: 4 PD27: Reliability of Electronics - Role of Intermetallic Compounds
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM PD28: PCB Designers Guide for Flexible and Rigid Flex Circuits- Planning, Design, Fabrication and Assembly Process Principles Instructor/Speaker: Vern Solberg, Technical Consultant, Solberg Technical Consulting Seminar Type: Professional Development Track: Design Location: 3 PD28: PCB Designers Guide for Flexible and Rigid Flex Circuits- Planning, Design, Fabrication and As
Mon, Jan 24, 2022 - 5:00 PM to 6:00 PM NewComers Reception Seminar Type: Special Event Location: West Terrace
Mon, Jan 24, 2022 - 5:30 PM to 6:30 PM International Reception Seminar Type: Special Event Location: Cityside Corridor(Upper Level)