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Date
Sat, Jan 22nd, 2022
Sun, Jan 23rd, 2022
Mon, Jan 24th, 2022
Tue, Jan 25th, 2022
Wed, Jan 26th, 2022
Thu, Jan 27th, 2022
Type
Professional Development
Special Event
Standards Development Meeting
Technical Conference Session
Posters
Management
Track
Assembly
Assembly Processes
Assembly Processes for Lead Free and Tin-Lead
Assembly Processes; Quality, Reliability, Test and Inspection
Assembly, Materials, and Environment
Circuit Design and Component Technologies
Cleaning/Coating/Contamination
Design
Design; Quality, Reliability, Test and Inspection
E-Textiles
F2
Factory of the Future
Leadership
Management
PCB
PCB Fabrication and Materials
PCB Fabrications and Materials
Printed Electronics
Quality, Reliability, Test and Inspection
Supply Chain/Business Issues
Test
Speaker
Adam Wheeler, Anthesis Group
Alan Burk, ALMAX
Albert Block, National Instruments
Alex Luorio, Avnet
Benjamin Jordan, JordanDSP.com, Inc.
Benoit Dagenais, Innovative Vehicle Institute
Bhanu Sood, Ph.D., Quality and Reliability Division, NASA Goddard Space Flight Center
Brian Chislea, Dow Corning
Catherine Hanlin, Precision Manufacturing Company, Inc.
Chaim Lubin
Charles Capers
Chris Church
Chris Jorgensen, IPC
Curtis Grosskopf, IBM Corporation
Dale Lee, Plexus Corporation
Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
David Hollingsworth, Ascentron, Inc.
David Lober, Kyzen Corporation
David Pogue
David Sommervold, TCLAD Incorporated
Deb Gude, Spartronics
Debbie Wade, Advanced Rework Technology
Denise Charest
Doug Pauls, Collins Aerospace
Dr. Beverley Christian, Ph.D., HDP User Group
Dr. Erika Crandall, TE Connectivity
Dr. Hans-Peter Tranitz, Continental Automotive GmbH
Dr. Mike Bixenman, Magnalytix, LLC
Dr. Philippe Jaeckle, Robert Bosch
Dr. Shekhar Chandrashekar, iNEMI
Dr. Stanton Rak, Ph.D.
Dr. Udo Welzel, Robert Bosch GmbH
Dudi Amir, Intel Corporation
Eddie Hofer, Collins Aerospace
Emma Hudson, Emma Hudson Technical Consultancy Ltd
Eric Camden, Foresite, Inc.
Erik Bergum, Founder PCB USA
Fonda Wu, Raytheon Company
Frank Honyotski, STI Electronics, Inc.
Frank Uibel, Uibel Consulting
Gaston Hidalgo, Toyota Motor North America
Gerry Partida, Summit Interconnect
Graham Naisbitt, Gen3 Systems Limited
Gustaf Martensson, Mycronic AB / KTH
Heike Woldt, Diehl Metal Applications
Helena Pasquito, EPTAC Corporation
Herb Snogren, Bristlecone LLC
Hermann Eicher, EPT
Ife Hsu, Intel Corporation
Jack Calderon, Lincoln International
Jackie Mattox, Women in Electronics
Jan Pedersen, Elmatica AS
Jason Keeping, Celestica International L.P.
Jason Spera, Aegis Software
Jeff Schake, ASM Assembly Systems
Jeffrey Duch, TandemWorks Customized Training Solutions L.L.C.
Jennie S. Hwang, Ph.D., H-Technologies Group
Jerry Magera, Motorola Solutions
Jim Hall, ITM Consulting
Jim Vanden Hogen, San Diego PCB
Joe Geiger, Bally Ribbon Mills
John Lau, Unimicron Technology Corporation
John W. Mitchell, IPC
Jonathon Vermillion, Ball Aerospace & Technologies Corp.
Joseph Kane, BAE Systems
Joshua Hudson
José Servin, Ph.D., Continental Temic SA de CV
Julie Ellis, TTM Technologies
Kelly Scanlon, IPC
Kristopher Moyer, CSUS
Lance Auer, Conductor Analysis Technologies, Inc.
Lee Ritchey, Ph.D., Speeding Edge
Leo Lambert, EPTAC Corporation
Linda Woody, LWC Consulting
Marc Peo, Heller Industries Inc.
Marie Parliman, BAE Systems
Mark Finstad, Flexible Circuit Technologies, Inc.
Mark McMeen, STI Electronics, INC.
Matt Kelly P.Eng, MBA, IPC
Michael Carano, RBP Chemical Technology, Inc.
Michael Creeden, EPTAC Corporation
Michelle Gleason, Plexus Corp.
Mike Konrad, Aqueous Technologies
Milea Kammer, Honeywell International
Milos Lazic, Indium Corporation
Neil Bolding, MacDermid Alpha Electronics Solutions
Nick Koop, TTM Technologies
Nick Morris, NextFlex
Paul Cooke, AGC
Phil Zarrow, ITM Consulting
Philip Henault, Raytheon
Pratyush Rai, Nanowear Inc.
Radu Diaconescu, Swissmic
Rajesh Kumar, TTM Technologies
Raminder Singh, Naval Surface Warfare Ctr
Ray Prasad, Ray Prasad Consultancy Group
Reza Ghaffarian, Jet Propulsion Laboratory
Richard Rumas, Honeywell Canada
Richard Snogren, Bristlecone LLC
Robert Cooke, NASA Johnson Space Center
Robert Toppel, e1ectr0n, inc.
Russell Nowland, Nokia Corporation
S. Shashika Fernando, Flintec Transducers (Pvt) Ltd.
Sahar Rostami, Myant, Inc.
Sarah Czaplewski Campbell, IBM
Scott Bowles, Lockheed Martin Corporation
Scott Northrup, AGY
Stephen Tisdale, Tisdale Environmental Consulting LLC
Steven Bowles, Lockheed Martin Corporation
Steven Martell, Nordson Sonoscan Inc.
Steven Williams, TRA Consulting
Susy Webb, Design Science
Symon Franklin, Custom Interconnect Ltd
Terry Fischer, Showa Denko Materials (America), Inc.
Thomas Edman, TTM Technologies
Thomas Marktscheffel
Thomas Ratledge, Asymtek
Tiberiu Baranyi, Flextronics Romania SRL
Tim Burke, Ph.D., Arch Systems Inc.
Todd Brassard, Calumet Electronics
Tom Vanderheyden, Americas at TTI, Inc.
Vern Solberg, Solberg Technical Consulting
Vicka Hammill, Honeywell Inc. Air Transport Systems
Vladan Koncar, ENSAIT GEMTEX Lab
Location
10
11A
11B
12
14A
14B
15AB
16B
17A
17B
1AB
2
3
4
5AB
6A
6C
6CF
6D
6E
6F
7A
7B
8
9
Booth 3209
Booth 3815
Cityside Corridor(Upper Level)
Exhibit Hall
Lobby D
West Terrace
General Standards Development Meeting
Assembly and Joining
Base Materials
Cleaning and Coating
E-Textiles
Electronic Packaging Design
Electronic Product Data Description
Embedded Devices
Fabrication Process
Flexible and Rigid-Flex Printed Boards
High Speed/High Frequency Interconnections
Management
Packaged Electronic Components
Printed Board Design Technology
Printed Electronics
Process Control
Product Assurance
Product Reliability
Rigid Printed Boards
Technology Solutions
Terms and Definitions
Testing
Programs: 201 - 202 of 202
Programs per Page
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IPC APEX EXPO 2022
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S36 A3 Interconnection Methods
Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
S36 A3 Interconnection Methods
IPC APEX EXPO 2022
Thu, Jan 27, 2022 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Data Exchange
Seminar Type: Standards Development Meeting
Location: 14A
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