Sat, Jan 22, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Sun, Jan 23, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Sun, Jan 23, 2022 - 8:00 AM to 12:00 PM
D-33A/7-31A: Joint IPC-6012/A-600 Task Group Meeting
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Chair: Denise Charest, Quality Engineer
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Sun, Jan 23, 2022 - 8:00 AM to 12:00 PM
D-61A/D-64AT: Flexible Printed Electronics Design Standard Task Group and IPC-6902 A-Team
Chair: Alan Burk, President, ALMAX
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Standards Development Meeting: Printed Electronics
Location: 7A
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD01: Flexible Circuits Design Through Test With Lessons Learned - Part I
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Instructor/Speaker: Nick Koop, Director of Application Engineering, TTM Technologies
Seminar Type: Professional Development
Track: PCB
Location: 5AB
PD01: Flexible Circuits Design Through Test With Lessons Learned - Part I
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD02: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in Acceptable Levels of Flux and Other Residues - Part I
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer (CTO), Magnalytix, LLC
Instructor/Speaker: Doug Pauls, Principal Materials and Process Engineer, Collins Aerospace
Instructor/Speaker: Mark McMeen, Vice President of Engineering and Manufacturing, STI Electronics, INC.
Seminar Type: Professional Development
Track: Assembly
Location: 4
PD02: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in A
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD03: Cleaning and Cleanliness Quantification Bootcamp - How to Clean and Test per IPC Standards
Instructor/Speaker: Mike Konrad, President, Aqueous Technologies
Seminar Type: Professional Development
Track: Assembly
Location: 3
PD03: Cleaning and Cleanliness Quantification Bootcamp - How to Clean and Test per IPC Standards
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD04: A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability
Instructor/Speaker: Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Professional Development
Track: Test
Location: 2
PD04: A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD05: Parts Placement Choices and Consequences
Instructor/Speaker: Susy Webb, Sr. PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Location: 1AB
PD05: Parts Placement Choices and Consequences
Sun, Jan 23, 2022 - 8:00 AM to 11:00 AM
PD06: Introduction to Machine Data Analytics in the EMS Industry
Instructor/Speaker: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Professional Development
Track: F2
Location: 6C
Machine Data Analytics
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD07: Flexible Circuits Design Through Test With Lessons Learned - Part II
Instructor/Speaker: Nick Koop, Director of Application Engineering, TTM Technologies
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Seminar Type: Professional Development
Track: PCB
Location: 5AB
PD07: Flexible Circuits Design Through Test With Lessons Learned - Part II
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD08: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in Acceptable Levels of Flux and Other Residues - Part II
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer (CTO), Magnalytix, LLC
Instructor/Speaker: Doug Pauls, Principal Materials and Process Engineer, Collins Aerospace
Instructor/Speaker: Mark McMeen, Vice President of Engineering and Manufacturing, STI Electronics, INC.
Seminar Type: Professional Development
Track: Assembly
Location: 4
PD08: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in A
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD09: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part I
Instructor/Speaker: Dale Lee, Sr. Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 3
PD09: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Desi
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD10: Designing PCB Stackups to Function up to 56 Gb/S - Part I
Instructor/Speaker: Lee Ritchey, Ph.D., Founder and President, Speeding Edge
Seminar Type: Professional Development
Track: Design
Location: 2
PD10: Designing PCB Stackups to Function up to 56 Gb/S - Part I
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD11: Routing Digital Boards
Instructor/Speaker: Susy Webb, Sr. PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Location: 1AB
PD11: Routing Digital Boards
Sun, Jan 23, 2022 - 2:30 PM to 4:00 PM
Committee Chairman Council Meeting(By Invitation)
Seminar Type: Standards Development Meeting
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD12: Aerospace AS9100D: 2016 in Plain English
Instructor/Speaker: Steven Williams, TRA Consulting
Seminar Type: Professional Development
Track: Management
Location: 5AB
PD12: Aerospace AS9100D: 2016 in Plain English
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
Instructor/Speaker: John Lau, Unimicron Technology Corporation
Seminar Type: Professional Development
Track: F2
Location: 4
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP) Part B
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD14: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part II
Instructor/Speaker: Dale Lee, Sr. Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 3
PD14: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Desi
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD15: Designing PCB Stackups to Function up to 56 Gb/S - Part II
Instructor/Speaker: Lee Ritchey, Ph.D., Founder and President, Speeding Edge
Seminar Type: Professional Development
Track: Design
Location: 2
PD15: Designing PCB Stackups to Function up to 56 Gb/S - Part II
Sun, Jan 23, 2022 - 4:00 PM to 5:00 PM
TAEC Meeting
Seminar Type: Standards Development Meeting
Location: 6E
Sun, Jan 23, 2022 - 5:00 PM to 6:00 PM
Chairman's Reception(By Invitation)
Seminar Type: Standards Development Meeting
Location: West Terrace
Mon, Jan 24, 2022 - 8:00 AM to 11:00 AM
PD20: PCB 102 & Process Defect
Instructor/Speaker: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Professional Development
Track: PCB
Location: 6C
PD20: PCB 102 & Process Defect
Mon, Jan 24, 2022 - 8:00 AM to 11:00 AM
CANCELLED
PD19: Non-Contact Additive Technologies in Contemporary Electronics Production and Related Fields
Instructor/Speaker: Gustaf Martensson, Expert Complex Fluids, Mycronic AB / KTH
Instructor/Speaker: Thomas Ratledge, Vice President of Engineering, Asymtek
Seminar Type: Professional Development
Track: F2
Location: 2
Mon, Jan 24, 2022 - 8:00 AM to 12:00 PM
2-17: Connected Factory Initiative Subcommittee
Chair: Jason Spera, CEO, Aegis Software
Chair: Thomas Marktscheffel
Chair: Marc Peo, President, Heller Industries Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 17B
Mon, Jan 24, 2022 - 8:00 AM to 12:00 PM
3-11: Laminate and Prepreg Subcommittee
Chair: Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
5-23B Component and Wire Solderability Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 8
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 14B
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
D-33A/7-31A: Joint IPC-6012/A-600 Task Group
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Mon, Jan 24, 2022 - 8:00 AM to 5:00 PM
E-31B: Supplier Declaration
Seminar Type: Standards Development Meeting
Location: 14A
Mon, Jan 24, 2022 - 8:00 AM to 5:00 PM
EMS Leadership Summit: EMS Leaders of Today and Tomorrow Helping Each Other and the Industry to Prosper
Instructor/Speaker: Thomas Edman, President and Chief Executive Officer, TTM Technologies
Instructor/Speaker: Deb Gude, Quote Supervisor / SBLO, Spartronics
Instructor/Speaker: Charles Capers, VP & General Manager
Instructor/Speaker: Jack Calderon, Managing Director, Lincoln International
Instructor/Speaker: Chaim Lubin, Managing Director
Instructor/Speaker: Robert Toppel, President, e1ectr0n, inc.
Instructor/Speaker: Todd Brassard, VP/COO, Calumet Electronics
Instructor/Speaker: Alex Luorio, Senior Vice President, Supplier Development, Avnet
Instructor/Speaker: Tom Vanderheyden, SVP, Supply Chain& Sales Enablement, Americas at TTI, Inc.
Instructor/Speaker: David Hollingsworth, VP Business Development/Founder, Ascentron, Inc.
Seminar Type: Management
Location: 6D
Advocacy Update
Economic Update
M&A Update
Robotics Automation
Workforce Training
Roster
Mon, Jan 24, 2022 - 8:00 AM to 11:00 AM
PD16: Press-fit Technology Deep Dive
Instructor/Speaker: Frank Uibel, General Manager, Uibel Consulting
Instructor/Speaker: Heike Woldt, Head of Product Development Press-fit technology, Diehl Metal Applications
Instructor/Speaker: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Instructor/Speaker: Dr. Philippe Jaeckle, Senior Expert, Robert Bosch
Instructor/Speaker: Hermann Eicher, Project Manager R&D, EPT
Instructor/Speaker: Dr. Erika Crandall, Senior R&D Engineer, TE Connectivity
Instructor/Speaker: Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Seminar Type: Professional Development
Track: PCB
Location: 5AB
PD16: Press-fit Technology Deep Dive
Mon, Jan 24, 2022 - 8:00 AM to 11:00 AM
PD17: Preventing Manufacturing Defects and Product Failure
Instructor/Speaker: Jennie S. Hwang, Ph.D., CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly
Location: 4
PD17: Preventing Manufacturing Defects and Product Failure
Mon, Jan 24, 2022 - 8:00 AM to 11:00 AM
PD18: Introduction to RF and Microwave PCB Design - Part I
Instructor/Speaker: Benjamin Jordan, CID+ PCB Design Engineer, JordanDSP.com, Inc.
Seminar Type: Professional Development
Track: Design
Location: 3
PD18: Introduction to RF and Microwave PCB Design - Part I
Mon, Jan 24, 2022 - 8:30 AM to 9:30 AM
7-31D: Optical Inspection Aides Task Group
Chair: S. Shashika Fernando, Senior Production Engineer, Flintec Transducers (Pvt) Ltd.
Chair: Joshua Hudson
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 10
Mon, Jan 24, 2022 - 10:00 AM to 12:00 PM
1-13: Land Pattern Subcommittee
Chair: Michelle Gleason, Engineer, Plexus Corp.
Chair: Kristopher Moyer, CSUS
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Electronic Packaging Design
Location: 10
Mon, Jan 24, 2022 - 10:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Process Control
Location: 7B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Chair: Richard Snogren, President, Bristlecone LLC
Chair: Raminder Singh, DoD Executive Agent for Printed Circuit Board & Interconnect Technology, Naval Surface Warfare Ctr
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 14B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
4-14B: ENIG Task Group
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
5-32C: Bare Board Cleanliness Assessment Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
7-31AT: IPC-A-600 Training Committee
Chair: Jeffrey Duch, Industry Trainer, TandemWorks Customized Training Solutions L.L.C.
Chair: Leo Lambert, Vice President, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 16B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
D-36: IPC-PCQR2 Database Subcommittee
Chair: Albert Block, Chef Manufacturing Strategist, National Instruments
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Mon, Jan 24, 2022 - 12:00 PM to 3:00 PM
CANCELLED
PD25: Measurement System Analysis For Electronics Assemblies - Part I
Instructor/Speaker: José Servin, Ph.D., Material Expert, Continental Temic SA de CV
Seminar Type: Professional Development
Track: Test
Location: 1AB
Mon, Jan 24, 2022 - 12:00 PM to 1:30 PM
Monday Awards Luncheon
Seminar Type: Special Event
Location: 6A
Mon, Jan 24, 2022 - 12:00 PM to 3:00 PM
PD21: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Board Talk - Part I
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Seminar Type: Professional Development
Track: Assembly
Location: 5AB
PD21: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Bo
Mon, Jan 24, 2022 - 12:00 PM to 3:00 PM
PD22: PCB Fabrication Basics: Process and Specification
Instructor/Speaker: Jim Vanden Hogen, Sr. PCB Designer, San Diego PCB
Seminar Type: Professional Development
Track: PCB
Location: 4
PD22: PCB Fabrication Basics: Process and Specification
Mon, Jan 24, 2022 - 12:00 PM to 3:00 PM
PD23: Introduction to RF and Microwave PCB Design - Part II
Instructor/Speaker: Benjamin Jordan, CID+ PCB Design Engineer, JordanDSP.com, Inc.
Seminar Type: Professional Development
Track: Design
Location: 3
PD23: Introduction to RF and Microwave PCB Design - Part II
Mon, Jan 24, 2022 - 12:00 PM to 3:00 PM
PD24: PCB Design and Process Implemention for Advanced Semiconductor Package Technologies- Flip-Chip, WLP, FOWLP, 2D, 2.5D and 3D
Instructor/Speaker: Vern Solberg, Technical Consultant, Solberg Technical Consulting
Seminar Type: Professional Development
Track: F2
Location: 2
PD24: PCB Design and Process Implemention for Advanced Semiconductor Package Technologies- Flip-Chip
Mon, Jan 24, 2022 - 1:30 PM to 5:00 PM
1-14: DFX
Seminar Type: Standards Development Meeting
Location: 11A
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Chair: Scott Northrup, VP of Sales & Marketing, AGY
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
4-14F ENEPIG Task Group
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
5-21P: Sintering Materials Task Group 
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 10
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Chair: Graham Naisbitt, CEO & Chairman, Gen3 Systems Limited
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum Task Group
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 17B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
D-33AT: IPC-A-6012 Training Committee
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 16B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
IPC 1791 Program
Seminar Type: Standards Development Meeting
Location: 7B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
V-TSL-MVIA Microvia Weak Interface Subcommittee
Chair: Gerry Partida, Vice President of Technology for Summit Interconnect, Summit Interconnect
Chair: Jerry Magera, Distinguished Innovator, Motorola Solutions
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Technology Solutions
Location: 15AB
Mon, Jan 24, 2022 - 3:00 PM to 5:00 PM
ITERC (By Invitation) 
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
1:10C: Test Coupon and Artwork Generation Task Group
Chair: Philip Henault, Development Engineer, Raytheon
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Printed Board Design Technology
Location: 15AB
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable
Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated
Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
B-10a/JEDEC
Seminar Type: Standards Development Meeting
Location: 7B
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 10
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM
CANCELLED
PD29: Measurement System Analysis For Electronics Assemblies - Part II
Instructor/Speaker: José Servin, Ph.D., Material Expert, Continental Temic SA de CV
Seminar Type: Professional Development
Track: Test
Location: 1AB
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM
PD26: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Board Talk - Part II
Instructor/Speaker: Phil Zarrow, President, ITM Consulting
Instructor/Speaker: Jim Hall, Principal Consultant, ITM Consulting
Seminar Type: Professional Development
Track: Assembly
Location: 5AB
PD26: Troubleshooting and Process Optimization- Lessons Learned from the Trenches and a Decade of Bo
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM
PD27: Reliability of Electronics - Role of Intermetallic Compounds
Instructor/Speaker: Jennie S. Hwang, Ph.D., CEO, H-Technologies Group
Seminar Type: Professional Development
Track: Assembly
Location: 4
PD27: Reliability of Electronics - Role of Intermetallic Compounds
Mon, Jan 24, 2022 - 3:30 PM to 6:30 PM
PD28: PCB Designers Guide for Flexible and Rigid Flex Circuits- Planning, Design, Fabrication and Assembly Process Principles
Instructor/Speaker: Vern Solberg, Technical Consultant, Solberg Technical Consulting
Seminar Type: Professional Development
Track: Design
Location: 3
PD28: PCB Designers Guide for Flexible and Rigid Flex Circuits- Planning, Design, Fabrication and As
Mon, Jan 24, 2022 - 5:00 PM to 6:00 PM
NewComers Reception
Seminar Type: Special Event
Location: West Terrace
Mon, Jan 24, 2022 - 5:30 PM to 6:30 PM
International Reception
Seminar Type: Special Event
Location: Cityside Corridor(Upper Level)
Tue, Jan 25, 2022 - 7:30 AM to 8:30 AM
V9-10: EMS Steering Committee Meeting
Seminar Type: Standards Development Meeting
General Standards Development Meeting: Management
Location: 7A
Tue, Jan 25, 2022 - 8:00 AM to 10:00 AM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 10
Tue, Jan 25, 2022 - 8:30 AM to 9:30 AM
Tuesday Opening Keynote
Speaker: David Pogue
Presentation: Disruptive Tech & How it Will Affect Your Business: What’s Coming by 2026
 
Instructor/Speaker: David Pogue
Seminar Type: Special Event
Location: 6A
Tue, Jan 25, 2022 - 9:45 AM to 10:00 AM
Ribbon Cutting Ceremony
Seminar Type: Special Event
Location: Lobby D
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
Chair: Adam Wheeler, Technical Supervisor, Anthesis Group
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 16B
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Vicka Hammill, Fellow Engineer, Honeywell Inc. Air Transport Systems
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Terms and Definitions
Location: 9
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
5-24G: Polymerics Standard Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 12
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
5-33A: Conformal Coating Task Group
Chair: Brian Chislea, Engineer, Dow Corning
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 15AB
Tue, Jan 25, 2022 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Chair: Gaston Hidalgo, Quality Product Engineer, Toyota Motor North America
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Chair: José Servin, Ph.D., Material Expert, Continental Temic SA de CV
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14B
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Product Assurance
Location: 14A
Tue, Jan 25, 2022 - 10:00 AM to 5:00 PM
E-31A: Generic Requirements for Declaration Process Management
Seminar Type: Standards Development Meeting
Location: 11A
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S01 - FF1 Quality and the Smart Factory
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S01 - FF1 Quality and the Smart Factory
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S02 - BF1 Microvia Design and Test 1
Sarah Czaplewski Campbell, IBM
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S02 - BF1 Microvia Design and Test 1
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S03 - QRTI 1 Reliability Issues
Moderator: Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S03_Quality, Reliability, Test and Inspection
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S04 - EM1 Conformal Coatings
Jason Keeping, Project Manager, Celestica International L.P.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 6C
S04 - EM1 Conformal Coatings
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
V-TPAC: IPC Training Program Advisory Committee
Seminar Type: Standards Development Meeting
Track: Leadership
General Standards Development Meeting: Management
Location: 6E
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Technology Solutions
Location: 7A
Tue, Jan 25, 2022 - 11:00 AM to 12:00 PM
IPC Design Competition 2022 Finals
Seminar Type: Special Event
Location: Booth 3209
Tue, Jan 25, 2022 - 12:00 PM to 1:30 PM
Luncheon and IPC Annual Meeting
Seminar Type: Special Event
Location: 6A
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Subcommittee
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 10
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 8
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-24A Flux Specification Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14A
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 16B
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Celestica International L.P.
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 15AB
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
7-24: Printed Board Fabrication and Assembly Process Effects Subcommittee
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Process Control
Location: 7A
Tue, Jan 25, 2022 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Chair: Michael Creeden, VP, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Rigid Printed Boards
Location: 9
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Chair: Rajesh Kumar, VP of Technology Solutions, TTM Technologies
Seminar Type: Standards Development Meeting
Track: Circuit Design and Component Technologies
General Standards Development Meeting: Embedded Devices
Location: 12
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S05 - FF2  Digital Twin / Data Transformation
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 3
S05 - FF2 Digital Twin / Data Transformation
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S06 - BF2 Microvia Design and Test 2
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 6C
S06 - BF2 Microvia Design and Test 2
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S07 - QRTI 2 Failure Analysis
Instructor/Speaker: Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 4
S07 - QRTI 2 Failure Analysis
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S08 EM2 Thermal Interface Materials 1
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 5AB
Kevin Brennan
Sanjay Misra
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
WORKFORCE TRAINING MEETING-CANCELLED
Seminar Type: Special Event
Location: 6E
Tue, Jan 25, 2022 - 2:00 PM to 6:00 PM
IPC Design Competition 2022 Finals
Seminar Type: Special Event
Location: Booth 3209
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
5-24C Solder Alloy Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Task Group
Chair: Reza Ghaffarian, Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 15AB
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-12: Microsection Subcommittee
Chair: Vicka Hammill, Fellow Engineer, Honeywell Inc. Air Transport Systems
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Testing
Location: 7A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-31 FT: IPC/WHMA-A-620 Training Committee
Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technology
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 6E
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Chair: Frank Honyotski, Instructor/Trainer, STI Electronics, Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 17A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 8
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S09 ET1 Innovative Technologies
Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 4
S09 ET1 Innovative Technologies
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 5AB
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S11 QRTI 3 Electrical Test Methods 1
Dr. Beverley Christian, Ph.D., Project Facilitator, HDP User Group
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S11 QRTI 3 Electrical Test Methods 1
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S12 EM3 Thermal Interface Materials 2
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 6C
S12 EM3 Thermal Interface Materials 2
Tue, Jan 25, 2022 - 5:00 PM to 6:00 PM
Technical Poster Networking Sessions

GRAB A DRINK OR ICE CREAM AND MINGLE WITH THE POSTER PRESENTERS ON THE SHOW FLOOR IN BOOTH 3815 DURING THE FOLLOWING TIMES:

Tuesday, January 25 | 5:00 pm-6:00 pm (during the show floor reception)
Wednesday, January 26 | 2:30 pm-3:30 pm (during the ice cream social) 
 
Seminar Type: Posters
Tue, Jan 25, 2022 - 5:00 PM to 6:00 PM
Meet and Network with Poster Presenters| During the Show Floor Reception
Seminar Type: Special Event
Location: Booth 3815
Tue, Jan 25, 2022 - 5:00 PM to 6:00 PM
Show Floor Reception
Seminar Type: Special Event
Location: Exhibit Hall
Tue, Jan 25, 2022 - 6:00 PM to 7:30 PM
Women in Electronics Reception at IPC APEX EXPO 
Instructor/Speaker: Jackie Mattox, Founder, President, and Chief Executive Officer, Women in Electronics
Seminar Type: Special Event
Location: 6F
Tue, Jan 25, 2022 - 7:30 PM to 8:30 PM
Technical Conference Speaker Breakfast (By Invitation Only) 
Instructor/Speaker: Dr. Stanton Rak, Ph.D.
Seminar Type: Special Event
Wed, Jan 26, 2022 - 7:00 AM to 8:00 AM
IPC Hall of Fame Council Meeting-CANCELLED
Seminar Type: Management
Location: 14A
Wed, Jan 26, 2022 - 7:30 AM to 8:30 AM
Technical Conference Speaker Breakfast (Invitation Only)
Instructor/Speaker: Dr. Stanton Rak, Ph.D.
Seminar Type: Special Event
Wed, Jan 26, 2022 - 7:30 AM to 9:00 AM
2-16D: 2581 Users Group
Seminar Type: Standards Development Meeting
Location: 9
Wed, Jan 26, 2022 - 8:00 AM to 9:00 AM
Wednesday Opening Keynote
Speaker: John W. Mitchell
Presentation: State of the Industry: Electronics Manufacturing Embraces Digital
 
Instructor/Speaker: John W. Mitchell, President and CEO, IPC
Seminar Type: Special Event
Location: 6A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-21E:Solder Stencil Task Group
Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 17B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Chair: Ife Hsu, Technology & Standards Development, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11B
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Chair: Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 17A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-24B Solder Paste Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 11A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
7-31BT: IPC-A-610 Training Committee
Chair: Marie Parliman, Technical Instructor, BAE Systems
Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 15AB
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Chair: Catherine Hanlin, General Manager, Precision Manufacturing Company, Inc.
Chair: Richard Rumas, Technical Manager, Honeywell Canada
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 6E
Wed, Jan 26, 2022 - 8:00 AM to 12:00 PM
7-31H/7-31K: IPC-HDBK-620 and IPC-D-620
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Design; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 16B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-15: Flex Circuits Test Methods Subcommittee
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-22: RF/Microwave Printed Board Performance Subcommittee
Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: High Speed/High Frequency Interconnections
Location: 7B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-55A: Embedded Circuitry Guideline Task Group
Chair: Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Standards Development Meeting
Track: Circuit Design and Component Technologies
General Standards Development Meeting: Embedded Devices
Location: 7A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-72A: Conductive Yarns for E-Textiles Task Group
Chair: Joe Geiger, Textile Engineer, Bally Ribbon Mills
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 12
Wed, Jan 26, 2022 - 8:00 AM to 12:00 PM
DOD Meeting
Seminar Type: Standards Development Meeting
Location: 8
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
E-31K: Materials and Substance
Seminar Type: Standards Development Meeting
Location: 10
Wed, Jan 26, 2022 - 9:00 AM to 3:00 PM
2-16 Product Data Description
Seminar Type: Standards Development Meeting
Location: 9
Wed, Jan 26, 2022 - 9:00 AM to 12:00 PM
PD31: Design WITH Manufacturing
Instructor/Speaker: Chris Church
Instructor/Speaker: Julie Ellis, TTM Technologies
Seminar Type: Professional Development
Track: Design
Location: 1AB
PD31: Design WITH Manufacturing
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S13 FF3  Artificial Intelligence and Machine Learning
Moderator: Matt Kelly P.Eng, MBA, Chief Technologist, IPC
Moderator: Chris Jorgensen, Director, Technology Transfer, IPC
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S13 FF3 Artificial Intelligence and Machine Learning
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S14 BF4  Surface Finishes & Coatings
Sarah Czaplewski Campbell, IBM
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S14 BF4 Surface Finishes & Coatings
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S15 QRTI 4  Tin Whiskers
Moderator: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S15 QRTI 4 Tin Whiskers
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S16  A1  Flux Technologies & Cleaning
Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 2
S16 A1 Flux Technologies & Cleaning
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-22BT: J-STD-001 Training Committee
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 15AB
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-23A Printed Board Solderability
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 7A
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-33B: Solder Mask Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Printed Board Performance Subcommittee
Chair: Nick Koop, Director of Application Engineering, TTM Technologies
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
D-72B: Woven, Knitted and Braided E-Textiles Standard Task Group
Chair: Sahar Rostami, Fiber and Textile Engineer, Myant, Inc.
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 12
Wed, Jan 26, 2022 - 11:30 AM to 12:00 PM
Refreshing the iNEMI Technology Roadmap for Electronics Manufacturing
Instructor/Speaker: Dr. Shekhar Chandrashekar, CEO, iNEMI
Seminar Type: Special Event
Location: 7B
Wed, Jan 26, 2022 - 12:00 PM to 1:30 PM
Awards Luncheon
Seminar Type: Special Event
Location: 6A
Wed, Jan 26, 2022 - 1:00 PM to 3:00 PM
5-45 AT: 7801 Reflow Oven Process Control Subcommittee-CANCELLED
Chair: Linda Woody, LWC Consulting
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Process Control
Location: 7B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM

S18 BF5 High-Density Interconnects / Semi-Additive Processes 2

Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S18 BF5 High-Density Interconnects / Semi-Additive Process 2e
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-73A: E-Textiles Printed Electronics Design Standard Task Group/D-74A Printed Electronics E-Textiles Electrical Test Task Group
Chair: Pratyush Rai, Founding Engineer, Nanowear Inc.
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 16B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11A
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Task Group
Seminar Type: Standards Development Meeting
Location: 8
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility-CANCEL
Chair: Eddie Hofer, Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-23: High Speed / High Frequency Base Materials
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 11B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
Day of DFX - Design Masters Ask Me Anything (AMA)
Seminar Type: Special Event
Location: Booth 3209
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S17 FF4 Modernizing the Supply Chain
Radu Diaconescu, Swissmic
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Location: 2
S17 FF4 Modernizing the Supply Chain
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S19 QRTI 5  Intermetallic and Corrosion Layers
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 5AB
S19 QRTI 5 Intermetallic and Corrosion Layers
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S20 A2 Solder Processes
Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
S20 A2 Solder Processes
Wed, Jan 26, 2022 - 1:30 PM to 2:30 PM
Tribal Knowledge Cultivation Project
Seminar Type: Special Event
Location: West Terrace
Wed, Jan 26, 2022 - 2:00 PM to 3:00 PM
Tradeshow Committee(By Invitation Only)
Seminar Type: Management
Location: 7A
Wed, Jan 26, 2022 - 2:30 PM to 3:30 PM
Ice Cream Social on the Show Floor
Seminar Type: Special Event
Location: Exhibit Hall
Wed, Jan 26, 2022 - 2:30 PM to 3:30 PM
Meet and Network with Poster Presenters| During the Ice Cream Social
Seminar Type: Special Event
Location: Booth 3815
Wed, Jan 26, 2022 - 3:00 PM to 6:00 PM
Day of DFX - DFX Spotlight Sessions
Seminar Type: Special Event
Location: Booth 3209
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
4-14E OSP Task Group
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Fabrication Process
Location: 11B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
5-33G: Low Pressure Molding Task Group
Chair: Eric Camden, Lead Investigator, Foresite, Inc.
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carriers Cracking Task Group
Chair: Stephen Tisdale, Consultant, Tisdale Environmental Consulting LLC
Chair: Steven Martell, Manager, Nordson Sonoscan Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 7A
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
B-11A: Electronic Packages Guideline Task Group
Chair: Dudi Amir, Technologist, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Packaged Electronic Components
Location: 12
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-21: RF/Microwave Printed Board Design Subcommittee
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: High Speed/High Frequency Interconnections
Location: 9
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 8
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-60: Printed Electronics Committee
Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Alpha Electronics Solutions
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Standards Development Meeting: Printed Electronics
Location: 11A
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-75A: E-Textiles Wearables Standard Task Group
Chair: Vladan Koncar, Professor, ENSAIT GEMTEX Lab
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 16B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
MIT Meet and greet
Seminar Type: Special Event
Location: 15AB
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
V-DCL: Design Community Leadership
Seminar Type: Standards Development Meeting
Location: 7B
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S21: AFFOA Session: Advancements in E-Textiles 1
Moderator: Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 2
S21: AFFOA Session: Advancements in E-Textiles 1
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S22 BF6 Printed Circuit Structures
Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S22 BF6 Printed Circuit Structures
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S23 QRTI 6 Electrical Test Methods 2
 
Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S23 QRTI 6 Electrical Test Methods 2
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S24 CE1 Sustainability
 
Kelly Scanlon, IPC
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 5AB
S24 CE1 Sustainability
Wed, Jan 26, 2022 - 6:30 PM to 8:00 PM
Trivia Networking Night with Mr. DJ
Seminar Type: Special Event
Location: 6D
Thu, Jan 27, 2022 - 7:30 AM to 8:00 AM
Technical Conference Speaker Breakfast (Invitation Only)
Instructor/Speaker: Dr. Stanton Rak, Ph.D.
Seminar Type: Special Event
Thu, Jan 27, 2022 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Chair: Dr. Beverley Christian, Ph.D., Project Facilitator, HDP User Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 9
Thu, Jan 27, 2022 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Chair: Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 11B
Thu, Jan 27, 2022 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Chair: Eddie Hofer, Engineer, Collins Aerospace
Chair: Richard Rumas, Technical Manager, Honeywell Canada
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 10
Thu, Jan 27, 2022 - 8:00 AM to 12:00 PM
E-31J: Lab Report Task Group
Seminar Type: Standards Development Meeting
Location: 14A
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S25 FF6 Cybersecurity
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S25 FF6 Cybersecurity
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S26 BF7 Additive Manufactured Electronics
Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S26 BF7 Additive Manufactured Electronics
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S27 QRTI 7 Circuit Pack Test
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S27 QRTI 7 Circuit Pack Test
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S28 EM4 Electronic Materials
Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 2
S28 EM4 Electronic Materials
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
SMEMA Committee Meeting
Seminar Type: Management
Location: 11A
Thu, Jan 27, 2022 - 9:00 AM to 2:30 PM
STEM Outreach Event 
Seminar Type: Special Event
Location: 6CF
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S29 ET2 Flexible Hybrid Printed Electronics - Fabrication & Testing
Nick Morris, FHE Technology Manager, NextFlex
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 2
S29 ET2 Flexible Hybrid Printed Electronics - Fabrication & Testing
Thu, Jan 27, 2022 - 10:00 AM to 11:30 PM
S30 BF8 High Speed PCBs & Signal Integrity Considerations
Moderator: Kelly Scanlon, IPC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 5AB
S30 BF8 High Speed PCBs & Signal Integrity Considerations
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S31 QRTI 8 Contamination
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 4
S31 QRTI 8 Contamination
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S32 EM5 Solder Alloys & Processes
Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
Gerjan Diepstraten, ITWEAE
Anna Lifton, MacDermid Alpha
Mohamed el amine Belhadi Ph.D. Student, Auburn University
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S33 ET3  Flexible Hybrid Electronics - Applications & Capabilities
Nick Morris, FHE Technology Manager, NextFlex
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S33 ET3 Flexible Hybrid Electronics - Applications & Capabilities
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S34 BF9  Dielectric Materials for Substrates
Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S34 BF9 Dielectric Materials for Substrates
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S35 QRTI 9  Temperature Cycling
 
Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 2
S35 QRTI 9 Temperature Cycling
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S36 A3 Interconnection Methods
Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
S36 A3 Interconnection Methods
Thu, Jan 27, 2022 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Data Exchange
Seminar Type: Standards Development Meeting
Location: 14A