Sat, Jan 22, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Sun, Jan 23, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Sun, Jan 23, 2022 - 8:00 AM to 12:00 PM
D-33A/7-31A: Joint IPC-6012/A-600 Task Group Meeting
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Chair: Denise Charest, Quality Engineer
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Sun, Jan 23, 2022 - 8:00 AM to 12:00 PM
D-61A/D-64AT: Flexible Printed Electronics Design Standard Task Group and IPC-6902 A-Team
Chair: Alan Burk, President, ALMAX
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Standards Development Meeting: Printed Electronics
Location: 7A
Sun, Jan 23, 2022 - 2:30 PM to 4:00 PM
Committee Chairman Council Meeting(By Invitation)
Seminar Type: Standards Development Meeting
Sun, Jan 23, 2022 - 4:00 PM to 5:00 PM
TAEC Meeting
Seminar Type: Standards Development Meeting
Location: 6E
Sun, Jan 23, 2022 - 5:00 PM to 6:00 PM
Chairman's Reception(By Invitation)
Seminar Type: Standards Development Meeting
Location: West Terrace
Mon, Jan 24, 2022 - 8:00 AM to 12:00 PM
2-17: Connected Factory Initiative Subcommittee
Chair: Jason Spera, CEO, Aegis Software
Chair: Thomas Marktscheffel
Chair: Marc Peo, President, Heller Industries Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 17B
Mon, Jan 24, 2022 - 8:00 AM to 12:00 PM
3-11: Laminate and Prepreg Subcommittee
Chair: Darren Hitchcock, Panasonic Industrial Devices Sales Company of America (PIDSA)
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 8:00 AM to 5:00 PM
5-22A/7-31B: J-STD-001 and IPC-A-610 Task Group
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Chair: Milea Kammer, Sr. Product Design Engineer, Honeywell International
Chair: Symon Franklin, Production Engineer, Custom Interconnect Ltd
Chair: Tiberiu Baranyi, Technical Support Manager, Flextronics Romania SRL
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 6E
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
5-23B Component and Wire Solderability Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 8
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
5-32A: Ion Chromatography/Ionic Conductivity Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group
Chair: Benoit Dagenais, Electric Vehicle Lead Technician, Innovative Vehicle Institute
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 14B
Mon, Jan 24, 2022 - 8:00 AM to 10:00 AM
D-33A/7-31A: Joint IPC-6012/A-600 Task Group
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Mon, Jan 24, 2022 - 8:00 AM to 5:00 PM
E-31B: Supplier Declaration
Seminar Type: Standards Development Meeting
Location: 14A
Mon, Jan 24, 2022 - 8:30 AM to 9:30 AM
7-31D: Optical Inspection Aides Task Group
Chair: S. Shashika Fernando, Senior Production Engineer, Flintec Transducers (Pvt) Ltd.
Chair: Joshua Hudson
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 10
Mon, Jan 24, 2022 - 10:00 AM to 12:00 PM
1-13: Land Pattern Subcommittee
Chair: Michelle Gleason, Engineer, Plexus Corp.
Chair: Kristopher Moyer, CSUS
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Electronic Packaging Design
Location: 10
Mon, Jan 24, 2022 - 10:00 AM to 12:00 PM
7-31M: Fiber Optic Cable Acceptability Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Process Control
Location: 7B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
2-19B: Trusted Supplier Task Group
Chair: Richard Snogren, President, Bristlecone LLC
Chair: Raminder Singh, DoD Executive Agent for Printed Circuit Board & Interconnect Technology, Naval Surface Warfare Ctr
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 14B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
4-14B: ENIG Task Group
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
5-32C: Bare Board Cleanliness Assessment Task Group
Chair: Emma Hudson, CTO, Emma Hudson Technical Consultancy Ltd
Chair: David Lober, Process Chemist, Kyzen Corporation
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
7-31AT: IPC-A-600 Training Committee
Chair: Jeffrey Duch, Industry Trainer, TandemWorks Customized Training Solutions L.L.C.
Chair: Leo Lambert, Vice President, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 16B
Mon, Jan 24, 2022 - 10:15 AM to 12:00 PM
D-36: IPC-PCQR2 Database Subcommittee
Chair: Albert Block, Chef Manufacturing Strategist, National Instruments
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Rigid Printed Boards
Location: 15AB
Mon, Jan 24, 2022 - 1:30 PM to 5:00 PM
1-14: DFX
Seminar Type: Standards Development Meeting
Location: 11A
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
3-12D: Woven Glass Reinforcement Task Group
Chair: Scott Northrup, VP of Sales & Marketing, AGY
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
4-14F ENEPIG Task Group
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
5-21P: Sintering Materials Task Group 
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 10
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
5-32B: SIR and Electrochemical Migration Task Group
Chair: Graham Naisbitt, CEO & Chairman, Gen3 Systems Limited
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 9
Mon, Jan 24, 2022 - 1:30 PM to 5:00 PM
D-33AA: IPC-6012 Automotive Addendum Task Group
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 17B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
D-33AT: IPC-A-6012 Training Committee
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 16B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
IPC 1791 Program
Seminar Type: Standards Development Meeting
Location: 7B
Mon, Jan 24, 2022 - 1:30 PM to 3:00 PM
V-TSL-MVIA Microvia Weak Interface Subcommittee
Chair: Gerry Partida, Vice President of Technology for Summit Interconnect, Summit Interconnect
Chair: Jerry Magera, Distinguished Innovator, Motorola Solutions
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Technology Solutions
Location: 15AB
Mon, Jan 24, 2022 - 3:00 PM to 5:00 PM
ITERC (By Invitation) 
Seminar Type: Standards Development Meeting
Location: 8
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
1:10C: Test Coupon and Artwork Generation Task Group
Chair: Philip Henault, Development Engineer, Raytheon
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Printed Board Design Technology
Location: 15AB
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
3-12E: Base Materials Roundtable
Chair: David Sommervold, Senior Principal Engineer, TCLAD Incorporated
Chair: Terry Fischer, VP Sales and Marketing, Showa Denko Materials (America), Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 7A
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
B-10a/JEDEC
Seminar Type: Standards Development Meeting
Location: 7B
Mon, Jan 24, 2022 - 3:15 PM to 5:00 PM
D-35: Printed Board Storage and Handling Subcommittee
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 10
Tue, Jan 25, 2022 - 7:30 AM to 8:30 AM
V9-10: EMS Steering Committee Meeting
Seminar Type: Standards Development Meeting
General Standards Development Meeting: Management
Location: 7A
Tue, Jan 25, 2022 - 8:00 AM to 10:00 AM
3-12A: Metallic Foil Task Group
Chair: Erik Bergum, VP Technology and Engineering, Founder PCB USA
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 10
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
2-15F: Obsolete and Discontinued Product Task Group
Chair: Curtis Grosskopf, Senior Engineer, IBM Corporation
Chair: Adam Wheeler, Technical Supervisor, Anthesis Group
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Electronic Product Data Description
Location: 16B
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
2-30: Terms and Definitions Committee
Chair: Vicka Hammill, Fellow Engineer, Honeywell Inc. Air Transport Systems
Chair: Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Terms and Definitions
Location: 9
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
5-24G: Polymerics Standard Task Group
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 12
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
5-33A: Conformal Coating Task Group
Chair: Brian Chislea, Engineer, Dow Corning
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 15AB
Tue, Jan 25, 2022 - 10:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum
Chair: Gaston Hidalgo, Quality Product Engineer, Toyota Motor North America
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Chair: José Servin, Ph.D., Material Expert, Continental Temic SA de CV
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14B
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
7-35: IPC-AJ-820 Task Group
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Product Assurance
Location: 14A
Tue, Jan 25, 2022 - 10:00 AM to 5:00 PM
E-31A: Generic Requirements for Declaration Process Management
Seminar Type: Standards Development Meeting
Location: 11A
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
V-TPAC: IPC Training Program Advisory Committee
Seminar Type: Standards Development Meeting
Track: Leadership
General Standards Development Meeting: Management
Location: 6E
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
V-TSL: Technology Solutions Committee
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: Supply Chain/Business Issues
General Standards Development Meeting: Technology Solutions
Location: 7A
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Subcommittee
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 10
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-21H: Bottom Termination Components (BTC) Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 8
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-24A Flux Specification Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14A
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-32E: CAF Task Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 16B
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
5-33C: Conformal Coating Handbook Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Chair: Jason Keeping, Project Manager, Celestica International L.P.
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 15AB
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
7-24: Printed Board Fabrication and Assembly Process Effects Subcommittee
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Process Control
Location: 7A
Tue, Jan 25, 2022 - 1:30 PM to 5:00 PM
D-31B: IPC-2221/2222 Task Group
Chair: Michael Creeden, VP, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Rigid Printed Boards
Location: 9
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
D-55: Embedded Devices Process Implementation Subcommittee
Chair: Rajesh Kumar, VP of Technology Solutions, TTM Technologies
Seminar Type: Standards Development Meeting
Track: Circuit Design and Component Technologies
General Standards Development Meeting: Embedded Devices
Location: 12
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
5-24C Solder Alloy Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 14A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Task Group
Chair: Reza Ghaffarian, Principal Engineer, Jet Propulsion Laboratory
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 15AB
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-12: Microsection Subcommittee
Chair: Vicka Hammill, Fellow Engineer, Honeywell Inc. Air Transport Systems
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Testing
Location: 7A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-31 FT: IPC/WHMA-A-620 Training Committee
Chair: Debbie Wade, Master IPC Trainer, Advanced Rework Technology
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 6E
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
7-34: IPC-7711/21 Rework, Repair and Modification
Chair: Frank Honyotski, Instructor/Trainer, STI Electronics, Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 17A
Tue, Jan 25, 2022 - 3:15 PM to 5:00 PM
D-33AM: IPC-6012 Medical Device Addendum Task Group
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 8
Wed, Jan 26, 2022 - 7:30 AM to 9:00 AM
2-16D: 2581 Users Group
Seminar Type: Standards Development Meeting
Location: 9
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-21E:Solder Stencil Task Group
Chair: Jeff Schake, Senior Engineer, ASM Assembly Systems
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 17B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-21G: Flip Chip Mounting Task Group
Chair: Ife Hsu, Technology & Standards Development, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11B
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
5-21N: Cold Joining/Press-fit Handbook Task Group
Chair: Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 17A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
5-24B Solder Paste Task Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 11A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
7-31BT: IPC-A-610 Training Committee
Chair: Marie Parliman, Technical Instructor, BAE Systems
Chair: Helena Pasquito, Master IPC Trainer, EPTAC Corporation
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 15AB
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
7-31F: IPC/WHMA-A-620 Task Group
Chair: Catherine Hanlin, General Manager, Precision Manufacturing Company, Inc.
Chair: Richard Rumas, Technical Manager, Honeywell Canada
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 6E
Wed, Jan 26, 2022 - 8:00 AM to 12:00 PM
7-31H/7-31K: IPC-HDBK-620 and IPC-D-620
Chair: Robert Cooke, Aerospace Engineer, NASA Johnson Space Center
Seminar Type: Standards Development Meeting
Track: Design; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 16B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-15: Flex Circuits Test Methods Subcommittee
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-22: RF/Microwave Printed Board Performance Subcommittee
Chair: Lance Auer, Engineering Fellow, Conductor Analysis Technologies, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: High Speed/High Frequency Interconnections
Location: 7B
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-55A: Embedded Circuitry Guideline Task Group
Chair: Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Standards Development Meeting
Track: Circuit Design and Component Technologies
General Standards Development Meeting: Embedded Devices
Location: 7A
Wed, Jan 26, 2022 - 8:00 AM to 10:00 AM
D-72A: Conductive Yarns for E-Textiles Task Group
Chair: Joe Geiger, Textile Engineer, Bally Ribbon Mills
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 12
Wed, Jan 26, 2022 - 8:00 AM to 12:00 PM
DOD Meeting
Seminar Type: Standards Development Meeting
Location: 8
Wed, Jan 26, 2022 - 8:00 AM to 5:00 PM
E-31K: Materials and Substance
Seminar Type: Standards Development Meeting
Location: 10
Wed, Jan 26, 2022 - 9:00 AM to 3:00 PM
2-16 Product Data Description
Seminar Type: Standards Development Meeting
Location: 9
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-21F: Ball Grid Array Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-22BT: J-STD-001 Training Committee
Chair: Jonathon Vermillion, Senior Engineer, Ball Aerospace & Technologies Corp.
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 15AB
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-23A Printed Board Solderability
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 7A
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
5-33B: Solder Mask Task Group
Chair: Fonda Wu, Senior Project Systems Engineer, Raytheon Company
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
D-12: Flexible Circuits Printed Board Performance Subcommittee
Chair: Nick Koop, Director of Application Engineering, TTM Technologies
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 10:15 AM to 12:00 PM
D-72B: Woven, Knitted and Braided E-Textiles Standard Task Group
Chair: Sahar Rostami, Fiber and Textile Engineer, Myant, Inc.
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 12
Wed, Jan 26, 2022 - 1:00 PM to 3:00 PM
5-45 AT: 7801 Reflow Oven Process Control Subcommittee-CANCELLED
Chair: Linda Woody, LWC Consulting
Chair: Joseph Kane, Sr. Principle Engineer, BAE Systems
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Process Control
Location: 7B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-73A: E-Textiles Printed Electronics Design Standard Task Group/D-74A Printed Electronics E-Textiles Electrical Test Task Group
Chair: Pratyush Rai, Founding Engineer, Nanowear Inc.
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 16B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-22H: Thermal Profiling Guide Task Group
Chair: Ray Prasad, Director Product Development, Ray Prasad Consultancy Group
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Assembly and Joining
Location: 11A
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-24F: Underfill Materials Task Group
Seminar Type: Standards Development Meeting
Location: 8
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
5-31J: Cleaning Compatibility-CANCEL
Chair: Eddie Hofer, Engineer, Collins Aerospace
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Chair: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
D-23: High Speed / High Frequency Base Materials
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Base Materials
Location: 11B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
4-14E OSP Task Group
Chair: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Fabrication Process
Location: 11B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
5-33G: Low Pressure Molding Task Group
Chair: Eric Camden, Lead Investigator, Foresite, Inc.
Seminar Type: Standards Development Meeting
Track: Cleaning/Coating/Contamination
General Standards Development Meeting: Cleaning and Coating
Location: 17B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
B-10A: Plastic Chip Carriers Cracking Task Group
Chair: Stephen Tisdale, Consultant, Tisdale Environmental Consulting LLC
Chair: Steven Martell, Manager, Nordson Sonoscan Inc.
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Assembly and Joining
Location: 7A
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
B-11A: Electronic Packages Guideline Task Group
Chair: Dudi Amir, Technologist, Intel Corporation
Seminar Type: Standards Development Meeting
Track: Assembly Processes for Lead Free and Tin-Lead
General Standards Development Meeting: Packaged Electronic Components
Location: 12
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-13: Flexible Circuits Base Materials Subcommittee
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Flexible and Rigid-Flex Printed Boards
Location: 14B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-21: RF/Microwave Printed Board Design Subcommittee
Chair: Scott Bowles, Assembly Ops, Lockheed Martin Corporation
Seminar Type: Standards Development Meeting
Track: Design
General Standards Development Meeting: High Speed/High Frequency Interconnections
Location: 9
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-33-AP: Printed Board Additive and Semi-Additive Processing Subcommittee
Chair: Herb Snogren, Consultant, Bristlecone LLC
Chair: Jan Pedersen, Senior Technical Advisor, Elmatica AS
Seminar Type: Standards Development Meeting
Track: PCB Fabrications and Materials
General Standards Development Meeting: Rigid Printed Boards
Location: 8
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-60: Printed Electronics Committee
Chair: Neil Bolding, Manager, Technical Services & Quality, MacDermid Alpha Electronics Solutions
Seminar Type: Standards Development Meeting
Track: Printed Electronics
General Standards Development Meeting: Printed Electronics
Location: 11A
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
D-75A: E-Textiles Wearables Standard Task Group
Chair: Vladan Koncar, Professor, ENSAIT GEMTEX Lab
Seminar Type: Standards Development Meeting
Track: E-Textiles
General Standards Development Meeting: E-Textiles
Location: 16B
Wed, Jan 26, 2022 - 3:15 PM to 5:00 PM
V-DCL: Design Community Leadership
Seminar Type: Standards Development Meeting
Location: 7B
Thu, Jan 27, 2022 - 8:00 AM to 10:00 AM
3-11G: Metal Corrosion Task Group
Chair: Dr. Beverley Christian, Ph.D., Project Facilitator, HDP User Group
Seminar Type: Standards Development Meeting
Track: Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Reliability
Location: 9
Thu, Jan 27, 2022 - 8:00 AM to 12:00 PM
5-21M: Cold Joining/Press-fit Task Group
Chair: Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Chair: Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Seminar Type: Standards Development Meeting
Track: Assembly Processes
General Standards Development Meeting: Assembly and Joining
Location: 11B
Thu, Jan 27, 2022 - 8:00 AM to 5:00 PM
7-31J: IPC-A-630 Task Group
Chair: Eddie Hofer, Engineer, Collins Aerospace
Chair: Richard Rumas, Technical Manager, Honeywell Canada
Seminar Type: Standards Development Meeting
Track: Assembly Processes; Quality, Reliability, Test and Inspection
General Standards Development Meeting: Product Assurance
Location: 10
Thu, Jan 27, 2022 - 8:00 AM to 12:00 PM
E-31J: Lab Report Task Group
Seminar Type: Standards Development Meeting
Location: 14A
Thu, Jan 27, 2022 - 1:30 PM to 5:00 PM
E-31H: Conflict Minerals Data Exchange
Seminar Type: Standards Development Meeting
Location: 14A