Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD07: Flexible Circuits Design Through Test With Lessons Learned - Part II
Instructor/Speaker: Nick Koop, Director of Application Engineering, TTM Technologies
Instructor/Speaker: Mark Finstad, Director of Engineering, Flexible Circuit Technologies, Inc.
Seminar Type: Professional Development
Track: PCB
Location: 5AB
PD07: Flexible Circuits Design Through Test With Lessons Learned - Part II
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD08: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in Acceptable Levels of Flux and Other Residues - Part II
Instructor/Speaker: Dr. Mike Bixenman, Chief Technology Officer (CTO), Magnalytix, LLC
Instructor/Speaker: Doug Pauls, Principal Materials and Process Engineer, Collins Aerospace
Instructor/Speaker: Mark McMeen, Vice President of Engineering and Manufacturing, STI Electronics, INC.
Seminar Type: Professional Development
Track: Assembly
Location: 4
PD08: Qualifying and Controlling both the CLEANING and NO-CLEAN Soldering Processes that Result in A
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD09: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly) and More - Part I
Instructor/Speaker: Dale Lee, Sr. Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 3
PD09: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Desi
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD10: Designing PCB Stackups to Function up to 56 Gb/S - Part I
Instructor/Speaker: Lee Ritchey, Ph.D., Founder and President, Speeding Edge
Seminar Type: Professional Development
Track: Design
Location: 2
PD10: Designing PCB Stackups to Function up to 56 Gb/S - Part I
Sun, Jan 23, 2022 - 12:00 PM to 3:00 PM
PD11: Routing Digital Boards
Instructor/Speaker: Susy Webb, Sr. PCB Designer, Design Science
Seminar Type: Professional Development
Track: Design
Location: 1AB
PD11: Routing Digital Boards
Sun, Jan 23, 2022 - 2:30 PM to 4:00 PM
Committee Chairman Council Meeting(By Invitation)
Seminar Type: Standards Development Meeting
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD12: Aerospace AS9100D: 2016 in Plain English
Instructor/Speaker: Steven Williams, TRA Consulting
Seminar Type: Professional Development
Track: Management
Location: 5AB
PD12: Aerospace AS9100D: 2016 in Plain English
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
Instructor/Speaker: John Lau, Unimicron Technology Corporation
Seminar Type: Professional Development
Track: F2
Location: 4
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP)
PD13: Fan-Out Wafer/Panel-Level Packaging (FOW/PLP) and System-in-Package (SiP) Part B
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD14: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Design for Assembly), DFF (Design for Printed Board Fabrication) and More - Part II
Instructor/Speaker: Dale Lee, Sr. Staff DFX Strategy Engineer, Plexus Corporation
Seminar Type: Professional Development
Track: Design
Location: 3
PD14: Design for Excellence: DFM (Design for Manufacturing), DFR (Design for Reliability), DFA (Desi
Sun, Jan 23, 2022 - 3:30 PM to 6:30 PM
PD15: Designing PCB Stackups to Function up to 56 Gb/S - Part II
Instructor/Speaker: Lee Ritchey, Ph.D., Founder and President, Speeding Edge
Seminar Type: Professional Development
Track: Design
Location: 2
PD15: Designing PCB Stackups to Function up to 56 Gb/S - Part II