Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S01 - FF1 Quality and the Smart Factory
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S01 - FF1 Quality and the Smart Factory
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S02 - BF1 Microvia Design and Test 1
Sarah Czaplewski Campbell, IBM
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S02 - BF1 Microvia Design and Test 1
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S03 - QRTI 1 Reliability Issues
Moderator: Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S03_Quality, Reliability, Test and Inspection
Tue, Jan 25, 2022 - 10:00 AM to 12:00 PM
S04 - EM1 Conformal Coatings
Jason Keeping, Project Manager, Celestica International L.P.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 6C
S04 - EM1 Conformal Coatings
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S05 - FF2  Digital Twin / Data Transformation
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 3
S05 - FF2 Digital Twin / Data Transformation
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S06 - BF2 Microvia Design and Test 2
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 6C
S06 - BF2 Microvia Design and Test 2
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S07 - QRTI 2 Failure Analysis
Instructor/Speaker: Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 4
S07 - QRTI 2 Failure Analysis
Tue, Jan 25, 2022 - 1:30 PM to 3:00 PM
S08 EM2 Thermal Interface Materials 1
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 5AB
Kevin Brennan
Sanjay Misra
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S09 ET1 Innovative Technologies
Dr. Hans-Peter Tranitz, Principal Technical Expert, Continental Automotive GmbH
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 4
S09 ET1 Innovative Technologies
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 5AB
S10 BF3 High-Density Interconnects / Semi-Additive Processes 1
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S11 QRTI 3 Electrical Test Methods 1
Dr. Beverley Christian, Ph.D., Project Facilitator, HDP User Group
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S11 QRTI 3 Electrical Test Methods 1
Tue, Jan 25, 2022 - 3:30 PM to 5:00 PM
S12 EM3 Thermal Interface Materials 2
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 6C
S12 EM3 Thermal Interface Materials 2
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S13 FF3  Artificial Intelligence and Machine Learning
Moderator: Matt Kelly P.Eng, MBA, Chief Technologist, IPC
Moderator: Chris Jorgensen, Director, Technology Transfer, IPC
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S13 FF3 Artificial Intelligence and Machine Learning
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S14 BF4  Surface Finishes & Coatings
Sarah Czaplewski Campbell, IBM
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S14 BF4 Surface Finishes & Coatings
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S15 QRTI 4  Tin Whiskers
Moderator: Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S15 QRTI 4 Tin Whiskers
Wed, Jan 26, 2022 - 10:00 AM to 12:00 PM
S16  A1  Flux Technologies & Cleaning
Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 2
S16 A1 Flux Technologies & Cleaning
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM

S18 BF5 High-Density Interconnects / Semi-Additive Processes 2

Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S18 BF5 High-Density Interconnects / Semi-Additive Process 2e
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S17 FF4 Modernizing the Supply Chain
Radu Diaconescu, Swissmic
Moderator: Tim Burke, Ph.D., CTO, Arch Systems Inc.
Seminar Type: Technical Conference Session
Location: 2
S17 FF4 Modernizing the Supply Chain
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S19 QRTI 5  Intermetallic and Corrosion Layers
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 5AB
S19 QRTI 5 Intermetallic and Corrosion Layers
Wed, Jan 26, 2022 - 1:30 PM to 3:00 PM
S20 A2 Solder Processes
Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
S20 A2 Solder Processes
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S21: AFFOA Session: Advancements in E-Textiles 1
Moderator: Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 2
S21: AFFOA Session: Advancements in E-Textiles 1
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S22 BF6 Printed Circuit Structures
Michael Carano, VP Technology and Business Development, RBP Chemical Technology, Inc.
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S22 BF6 Printed Circuit Structures
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S23 QRTI 6 Electrical Test Methods 2
 
Bhanu Sood, Ph.D., Chief Engineer - Quality and Reliability Division, Quality and Reliability Division, NASA Goddard Space Flight Center
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S23 QRTI 6 Electrical Test Methods 2
Wed, Jan 26, 2022 - 3:30 PM to 5:00 PM
S24 CE1 Sustainability
 
Kelly Scanlon, IPC
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 5AB
S24 CE1 Sustainability
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S25 FF6 Cybersecurity
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S25 FF6 Cybersecurity
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S26 BF7 Additive Manufactured Electronics
Steven Bowles, Electronics Engineering Staff, Space, Lockheed Martin Corporation
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S26 BF7 Additive Manufactured Electronics
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S27 QRTI 7 Circuit Pack Test
Moderator: Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 3
S27 QRTI 7 Circuit Pack Test
Thu, Jan 27, 2022 - 8:00 AM to 9:30 AM
S28 EM4 Electronic Materials
Dr. Stanton Rak, Ph.D.
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 2
S28 EM4 Electronic Materials
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S29 ET2 Flexible Hybrid Printed Electronics - Fabrication & Testing
Nick Morris, FHE Technology Manager, NextFlex
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 2
S29 ET2 Flexible Hybrid Printed Electronics - Fabrication & Testing
Thu, Jan 27, 2022 - 10:00 AM to 11:30 PM
S30 BF8 High Speed PCBs & Signal Integrity Considerations
Moderator: Kelly Scanlon, IPC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 5AB
S30 BF8 High Speed PCBs & Signal Integrity Considerations
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S31 QRTI 8 Contamination
Moderator: Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 4
S31 QRTI 8 Contamination
Thu, Jan 27, 2022 - 10:00 AM to 11:30 AM
S32 EM5 Solder Alloys & Processes
Milos Lazic, Indium Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
Gerjan Diepstraten, ITWEAE
Anna Lifton, MacDermid Alpha
Mohamed el amine Belhadi Ph.D. Student, Auburn University
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S33 ET3  Flexible Hybrid Electronics - Applications & Capabilities
Nick Morris, FHE Technology Manager, NextFlex
Seminar Type: Technical Conference Session
Track: Factory of the Future
Location: 5AB
S33 ET3 Flexible Hybrid Electronics - Applications & Capabilities
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S34 BF9  Dielectric Materials for Substrates
Paul Cooke, Application Engineering Manager, AGC
Seminar Type: Technical Conference Session
Track: PCB Fabrication and Materials
Location: 4
S34 BF9 Dielectric Materials for Substrates
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S35 QRTI 9  Temperature Cycling
 
Dr. Udo Welzel, Manager/Supervisor, Robert Bosch GmbH
Seminar Type: Technical Conference Session
Track: Quality, Reliability, Test and Inspection
Location: 2
S35 QRTI 9 Temperature Cycling
Thu, Jan 27, 2022 - 12:00 PM to 1:30 PM
S36 A3 Interconnection Methods
Russell Nowland, Nokia Corporation
Seminar Type: Technical Conference Session
Track: Assembly, Materials, and Environment
Location: 3
S36 A3 Interconnection Methods