Unimicron Technology Corporation

With more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, John has published more than 500 peer-reviewed papers, 30 issued and pending US patents, and 21 textbooks on, e.g., Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integrations (Springer 2019)....

President and CEO

IPC

As IPC’s president and CEO, John W. Mitchell leads the organization’s global operations and staff. Working with the IPC board of directors, he is responsible for assisting in the development and implementation of the Board’s strategic vision and aspirational goals....

Senior Engineer

Ball Aerospace & Technologies Corp.

Bio Available Soon

Material Expert

Continental Temic SA de CV

He is Level 3 Senior Process Engineer at Continental-Vitesco Cuautla. He has worked at Continental-Vitesco for more than 16 years in various areas of electronics assembly, such as, SMT, final assembly and coil-manufacturing areas....

Sr. Principle Engineer

BAE Systems

Bio Available Soon

President

Precision Analytical Laboratory, Inc.

Bio Available Soon

TTM Technologies

IPC

CSUS

Bio Available Soon