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Instructor/Speaker(s): 101 - 110 of 147
Instructor/Speaker
Nichole C. Thilges
Sr. Training and Development
Raytheon Missile Systems
Bio Available Soon
Nick Koop
Director of Application Engineering
TTM Technologies
Nick Koop is the Director of Application Engineering for TTM Technologies and has over 35 years of design, manufacturing and management experience in the flexible circuit industry. Nick has developed and applied advanced PCB technologies to support a wide range medical, military, and global security applications....
Nick Morris
FHE Technology Manager
NextFlex
Nick Morris is the FHE Technology Manager at NextFlex where he is responsible for driving technology roadmapping and technical management of the Project Calls, which fund development of flexible hybrid electronics (FHE) manufacturing processes and applications....
Ning-Cheng Lee
NCL Consultants
Paige Fiet
Michigan Technological University
Paul Cooke
Application Engineering Manager
AGC
Paul Cooke has more than 30 years of experience in printed board (PWB) design and manufacturing. Paul has held senior positions in Operations, Quality, Process Engineering and Field Application Engineering, at some of the top North American PCB manufacturers....
Phil Zarrow
President
ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Philip Henault
Development Engineer
Raytheon
Bio Available Soon
Pratyush Rai
Founding Engineer
Nanowear Inc.
Bio Available Soon
Radu Diaconescu
Swissmic
Bio Available Soon