Micro-electronic assembly, Prototype thru production involving SMT down to 1005, bare die placement, wire bond (ball/wedge, wedge/wedge, ribbon, Au, Cu, Al),flip chip ( all substrates, bumps - solder, Au, copper pillar), Most substrates - organics, flex, rigid flex, Rogers, ceramics. Full turnkey, custom packages and box builds. Full reliability and analysis capabilities in-house. Parent company is H.B. Fuller offering a full line of engineering adhesives and epoxies including wearable adhesives. (less)