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Programs: 61 - 70 of 89
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall, TE Connectivity, NC
Committee Chair: Udo Welzel, Robert Bosch GmbH
Event Type: Standards Development Meeting
Location: 101D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
D-13: Flex Circuits Base Materials
Committee Chair: Richard Wessel, DuPont Electronics & Imaging
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
D-22: RF/Microwave Printed Board Performance Subcommittee
Committee Chair: Lance Auer, Conductor Analysis Technologies, Inc.
Event Type: Standards Development Meeting
Location: 101B
Tue, May 16, 2023 - 5:30 PM to 9:00 PM
Tuesday Gnome Awards
Event Type: Standards Development Meeting
Location: Ballroom C
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
7-12: Microsection Subcommittee
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 9:00 AM to 5:00 PM
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
Committee Chair: Gaston Hidalgo, Toyota Motor North America
Committee Chair: Jose Servin Olivares, Vitesco Technologies
Event Type: Standards Development Meeting
Location: 102A
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
7-35: Assembly and Joining Handbook Subcommittee
Committee Chair: Joseph Kane, BAE Systems
Event Type: Standards Development Meeting
Location: Ballroom AB
Wed, May 17, 2023 - 9:00 AM to 12:00 PM
D-33A/7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting
Committee Chair: Scott Bowles, Lockheed Martin Corporation
Committee Chair: Gerry Partida, Summit Interconnect - Anaheim
Event Type: Standards Development Meeting
Location: 102C