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Programs: 71 - 80 of 89
Wed, May 17, 2023 - 9:00 AM to 5:00 PM
E-30/E-31: Materials and Supplier Declarations and Supplier Declaration Joint Meeting
Committee Chair: Chuck LePard, DXC Technology
Event Type: Standards Development Meeting
Location: 102E
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
3-12A: Metallic Foil Task Group
Committee Chair: Erik Bergum, Founder PCB USA
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
5-22BT: J-STD-001 Training Committee
Committee Chair: George Tristan, Ball Aerospace & Technologies Corp.
Event Type: Standards Development Meeting
Location: 102D
Wed, May 17, 2023 - 10:00 AM to 12:00 PM
Technology Solutions Committee
Event Type: Standards Development Meeting
Location: 101A
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
3-13: Halogen-Free Materials Subcommittee
Committee Chair: Naji Norder, National Instruments
Event Type: Standards Development Meeting
Location: 101C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM
5-22F: IPC-HDBK-001 Task Group
Committee Chair: John Mastorides, Honeywell Aerospace
Committee Chair: Scott Meyer, Collins Aerospace
Event Type: Standards Development Meeting
Location: Ballroom AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
5-32E: Conductive Anodic Filament (CAF) Task Group
Committee Chair: Karl Sauter, Oracle America, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
7-24B: Printed Board Assembly Process Handbook Task Group
Committee Chair: Zhiman Chen, ZhuZhou CRRC Times Electric Co., Ltd.
Event Type: Standards Development Meeting
Location: 101A
Wed, May 17, 2023 - 1:30 PM to 3:00 PM
7-31BT: IPC-A-610 Training Committee
Committee Chair: Marie Parliman, BAE Systems
Committee Chair: Helena Pasquito, EPTAC LLC
Event Type: Standards Development Meeting
Location: 103C
Wed, May 17, 2023 - 1:30 PM to 5:00 PM
7-34: Repairability Subcommittee
Committee Chair: Frank Honyotski, STI Electronics, Inc.
Event Type: Standards Development Meeting
Location: 102B