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Programs: 61 - 70 of 125
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
7-34T: IPC-7711 7721 Training Committee
Committee Chair: Frank Honyotski, STI Electronics, Inc.
Event Type: Standards Development Meeting
Location: 103AB
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
B-10A: Plastic Chip Carrier Cracking Task Group
Committee Chair: Christina Landon, Naval Surface Warfare Ctr
Committee Chair: Steve Martell, Nordson ASYMTEK
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
D-11: Flexible Printed Board Design Subcommittee
Committee Chair: Mark Finstad, Flexible Circuit Technologies, Inc.
Event Type: Standards Development Meeting
Location: 102E
Tue, May 16, 2023 - 1:30 PM to 3:00 PM
D-23: High Speed High Frequency Base Materials Subcommittee
Committee Chair: Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA)
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 3:00 PM to 5:00 PM
Ultrasonic Metal Welding Basics and Applications Trend
Instructor/Speaker: Home Mojal, Special Systems Sales Manager, Telsonic Solutions
Event Type: Professional Development
Location: 202-AB
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
2-12A: Generic Requirements for Digital Twin Task Group
Instructor/Speaker: Radu Diaconescu, Swissmic
Instructor/Speaker: Michael Ford, Aegis Software UK
Event Type: Standards Development Meeting
Location: 101A
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
4-14E: OSP Task Group
Committee Chair: Michael Carano, IPC
Event Type: Standards Development Meeting
Location: 102D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
5-21N: Cold Joining/Press-fit Task Group
Committee Chair: Erika Crandall, TE Connectivity, NC
Committee Chair: Udo Welzel, Robert Bosch GmbH
Event Type: Standards Development Meeting
Location: 101D
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
6-10D: SMT Attachment Reliability Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 102B
Tue, May 16, 2023 - 3:15 PM to 5:00 PM
7-31N: Manual Magnification Aides Task Group
Committee Chair: Ernst Eggelaar, Microtronic M. V. GmbH
Committee Chair: Gerard O'Brian, Solderability Testing & Solutions, Inc.
Event Type: Standards Development Meeting
Location: 103AB